According to one embodiment, a calculating device includes a nonlinear oscillator. The nonlinear oscillator includes a circuit part including a first Josephson junction and a second Josephson junction, and a conductive member including a first terminal. An electrical signal is input to the first terminal. The electrical signal includes a first signal in a first operation. The first signal includes a first frequency component having a first frequency, and a second frequency component having a second frequency. The first frequency is 2 times an oscillation frequency of the nonlinear oscillator. An absolute value of a difference between the first frequency and the second frequency is not more than 0.3 times the first frequency.

According to one embodiment, a calculating device includes a nonlinear oscillator. The nonlinear oscillator includes a circuit part including a first Josephson junction and a second Josephson junction, and a conductive member including a first terminal. An electrical signal is input to the first terminal. The electrical signal includes a first signal in a first operation. The first signal includes a first frequency component having a first frequency, and a second frequency component having a second frequency. The first frequency is 2 times an oscillation frequency of the nonlinear oscillator. An absolute value of a difference between the first frequency and the second frequency is not more than 0.3 times the first frequency.

According to one embodiment, a calculating device includes nonlinear oscillators, connectors, and a controller. One of the connectors connects at least two of the nonlinear oscillators. The nonlinear oscillators include first and second nonlinear oscillators. The first nonlinear oscillator includes a first circuit part and a first conductive member. The first circuit part includes first and second Josephson junctions. The second nonlinear oscillator includes a second circuit part and a second conductive member. The second circuit part includes third and fourth Josephson junctions. Numbers of the connectors connected to the first and second connectors are first and second numbers, respectively. The second number is greater than the first number. The controller performs at least a first operation of supplying a first signal to the first conductive member and supplying a second signal to the second conductive member. The second signal is different from the first signal.

According to one embodiment, a calculating device includes nonlinear oscillators, connectors, and a controller. One of the connectors connects at least two of the nonlinear oscillators. The nonlinear oscillators include first and second nonlinear oscillators. The first nonlinear oscillator includes a first circuit part and a first conductive member. The first circuit part includes first and second Josephson junctions. The second nonlinear oscillator includes a second circuit part and a second conductive member. The second circuit part includes third and fourth Josephson junctions. Numbers of the connectors connected to the first and second connectors are first and second numbers, respectively. The second number is greater than the first number. The controller performs at least a first operation of supplying a first signal to the first conductive member and supplying a second signal to the second conductive member. The second signal is different from the first signal.

In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

An energy efficient rapid single flux quantum (ERSFQ) logic register wheel includes a circular shift register having a plurality of destructive read out (DRO) cells. Each entry of the circular shift register includes a data block, a tag, and a valid bit. A compare and control logic is coupled to the circular shift register to compare a source specifier or a destination register specifier against a register tag stored in the wheel following each cycle of the register wheel. At least one or more read ports and at least one or more write ports are coupled to the circular shift register to write to or to read from a different entry each in the register wheel following each cycle of the register wheel. A RSFQ clearable FIFO with flushing and a crosspoint memory topology for integrating MRAM devices with ERSFQ circuits are also described.

In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

An energy efficient rapid single flux quantum (ERSFQ) logic register wheel includes a circular shift register having a plurality of destructive read out (DRO) cells. Each entry of the circular shift register includes a data block, a tag, and a valid bit. A compare and control logic is coupled to the circular shift register to compare a source specifier or a destination register specifier against a register tag stored in the wheel following each cycle of the register wheel. At least one or more read ports and at least one or more write ports are coupled to the circular shift register to write to or to read from a different entry each in the register wheel following each cycle of the register wheel. A RSFQ clearable FIFO with flushing and a crosspoint memory topology for integrating MRAM devices with ERSFQ circuits are also described.