Disclosed are combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags and methods of producing such tags using a converting machine. The method is characterized by feeding a first roll carrying first type inlays and a second roll carrying second type inlays into a converting machine; and, transferring, using the converting machine, the first type inlays to a surface of the second type inlays, thereby forming a two-layer tape carrying pairs of first and second type inlays, each of the pairs comprising an RFID inlay and an EAS inlay, wherein there is no overlap of an RFID antenna element of each RFID inlay and an EAS antenna element of a paired EAS inlay, and wherein the RFID inlay and the EAS inlay of each pair are functionally independent.

The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e. the release layer (40), is provided with an operation hole (42), a chip (21) and a fingerprint identification element (23) provided on various electronic modules (20) can communicate with the outside, and the user can directly carry out an operation of inputting the program code by means of the electronic module preparation layer (A), thereby effectively improving the defect in the prior art that various electronic modules (20) can easily be bent and damaged when directly inputting into the electronic modules (20), and an electronic module preparation layer (A) is thus provided.

A method of manufacturing an RFID tag assembly, the method comprising: providing a mounting base made of an electrically conductive material; providing a passive mount-on-metal RFID tag, the RFID tag comprising an IC chip and an antenna provided on one side; mounting the RFID tag on the mounting base with said one side of the RFID tag coupled to the mounting base, to form an RFID tag-mounting base sub-assembly; providing a mold tool comprising a mold cavity shaped to form a cover of the RFID tag assembly and locating the RFID tag-mounting base sub-assembly within the mold cavity; and delivering a substantially RF transparent material in a molten state into the void between the mold tool and the RFID tag-mounting base sub-assembly and allowing the material to cool into a solid state to form a cover over the RFID tag-mounting base sub-assembly, such that the mounting base and the cover together encapsulate the RFID tag. The substantially RF transparent material has a temperature in the molten state on delivery into the void that is higher than a maximum tolerable temperature of the IC chip and the molten material is delivered into the void at a position removed from IC chip. The IC chip position such that the temperature of the molten material does not exceed the maximum tolerable temperature of the IC chip when the substantially RF transparent material reaches the IC chip.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A near field communication ring that can be read by nearby NFC-enabled devices. The ring comprises an annular shell and a near field communication transponder mounted on the annular shell. The near field communication transponder has a coil antenna that has a plurality of turns that each extend around the entire circumference of the annular shell. The rings has various potential applications including, for example, contactless payment, ticketing on mass transit systems, operation of NFC door locks or other access systems, identity authentication, venue or event entry/ticketing and the sharing of information with NFC-enabled smartphones.

Provided is a method for manufacturing a field-effect transistor, the method including the steps of: forming a gate electrode on the surface of a substrate; forming a gate insulating layer on the gate electrode; forming a conductive film containing a conductor and a photosensitive organic component by a coating method on the gate insulating layer; exposing the conductive film from the rear surface side of the substrate with the gate electrode as a mask; developing the exposed conductive film to form a source electrode and a drain electrode; and forming a semiconductor layer by a coating method between the source electrode and the drain electrode. This method makes it possible to provide an FET, a semiconductor device, and an RFID which can be prepared by a simple process, and which have a high mobility, and have a gate electrode and source/drain electrodes aligned with a high degree of accuracy.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.