Metal layers (650, 730, 750, 830, 850) of a smartcard (SC, 600, 700, 800) have module openings (614, 712, 714, 812, 814) for receiving a transponder chip module (TCM). Thermosetting resin (TR, 668B, 768A, 768B, 868A, 868B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer (650, 750, 850) may have a slit (S; 620, 720B, 820) which may also be filled by the thermosetting resin. A second metal layer (ML, 730) disposed above the first metal layer (750) may have a slit (S, 720A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC, 844) may be disposed between the first and second metal layers, with magnetic shielding material (842) disposed between the booster antenna circuit and the second metal layer (730).

Disclosed are combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags and methods of producing such tags using a converting machine. The method is characterized by feeding a first roll carrying first type inlays and a second roll carrying second type inlays into a converting machine; and, transferring, using the converting machine, the first type inlays to a surface of the second type inlays, thereby forming a two-layer tape carrying pairs of first and second type inlays, each of the pairs comprising an RFID inlay and an EAS inlay, wherein there is no overlap of an RFID antenna element of each RFID inlay and an EAS antenna element of a paired EAS inlay, and wherein the RFID inlay and the EAS inlay of each pair are functionally independent.

A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.

The present invention provides an RFID tag and a processing method for an RFID tag. The RFID tag is mainly applied to a rubber product. The RFID tag includes: a substrate, a chip and an antenna; a chip is arranged on a substrate, wherein the chip has a predetermined code thereon to enable a reader to identify; an antenna, in which the antenna is in a communication connection with a chip, and is configured for transmitting a radio frequency signal between the chip and a reader; the substrate is further provided with a connecting part, and the antenna is connected to the substrate through the connecting part. The RFID tag in the present invention solves the problem in the related art that a substrate in a RFID tag is not reliably connected to an antenna.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.

A method of manufacturing a relay includes a molded resin element step configured to produce a molded resin element with an IC chip is embedded therein by injecting a resin around the IC chip; an assembly step configured to apply the molded resin element to a base material as an exterior jacket component of the relay, the base material serving as the main body of the relay; and an antenna wiring forming step configured to print an antenna wiring on a surface of the molded resin element, the antenna wiring configured to allow the IC chip to perform wireless communication.

An RFID tag includes a first conductor and second conductors that are connected to each other to provide a main portion or all of a coil-shaped conductor or a loop-shaped conductor. Moreover, an RFIC is connected to the second conductors or is electromagnetically coupled to the second conductors. The first conductor includes terminals provided such that an end projects outward from a winding range of the coil-shaped conductor or a loop-shaped conductor while the first conductor is connected to the second conductors.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.