In some embodiments, a radio frequency identification (RFID) device may include a reactive strap may include a conductor enclosing an area and an RFID chip connected to the conductor, the conductor enclosing an area and defining a first opening, and a flexible substrate attached to the conductor and defining a second opening. The first and second openings together may define a passage through both the conductor and the flexible backing material.

Provided is a transparent antenna comprising a transparent base material, an antenna part, and a joint part electrically bonded to the antenna part, the antenna part and the joint part being arranged on the transparent base material, wherein the joint part has a first conductive pattern and a first opening part without the first conductive pattern formed thereon, the antenna part has a second conductive pattern and a second opening part without the second conductive pattern formed thereon, surface free energy E.sub.1 of the first conductive pattern is 60 mJ/m.sup.2 or less, and surface free energy E.sub.0 of the transparent base material at the first opening part is larger than the surface free energy E.sub.1.

A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.

An RFID tag is provided with a base member, an antenna portion and an IC chip. A split-ring resonator portion of the antenna portion has a first part and a second part. First end portions of the first part are provided with a first facing portion and a first connection portion, respectively. Second end portions of the second part are provided with a second facing portion and a second connection portion, respectively. The first and the second facing portions are apart from and face each other. A third end portion of the impedance matching portion is connected to the first part between the first facing portion and the first connection portion, and another third end portion is connected to the second part between the second facing portion and the second connection portion. The IC chip is connected to the first connection portion and the second connection portion.

An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.

A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

The present application relates to an electronic document module comprising a medium having a so-called internal face provided with at least two contact interfaces with an antenna, each of the contact interfaces with the antenna of the internal face of the medium being configured to be in contact with a connection pad of an antenna of an electronic document body, and with a chip comprising at least one I/O port, and one of the two contact interfaces with the antenna of the internal face of the medium being connected to the I/O port of the chip. The application also relates to an electronic document comprising such a module and a method for checking a connection between the module and a corresponding antenna.

The present invention provides an RFID tag and a processing method for an RFID tag. The RFID tag is mainly applied to a rubber product. The RFID tag includes: a substrate, a chip and an antenna; a chip is arranged on a substrate, wherein the chip has a predetermined code thereon to enable a reader to identify; an antenna, in which the antenna is in a communication connection with a chip, and is configured for transmitting a radio frequency signal between the chip and a reader; the substrate is further provided with a connecting part, and the antenna is connected to the substrate through the connecting part. The RFID tag in the present invention solves the problem in the related art that a substrate in a RFID tag is not reliably connected to an antenna.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

A radio frequency identification (RFID) tag includes a substrate; and an inductive-capacitive circuit located on the substrate. The circuit includes a corrugated inductive antenna to communicate with a RFID interrogator using radio frequency signals. The circuit further includes a capacitor coupled to the corrugated inductive antenna.