In some embodiments, an RFID device may include a multilayer reactive strap having a first substrate, a first conductor portion, a second conductor portion, and a first connection. The first conductor portion may enclose a first area and may be disposed on a first side of first substrate. A second conductor portion may enclose a second area and may be disposed on a second side of the first substrate. A first connection may couple the first conductor portion and the second conductor portion together, and may thereby form a multiturn coil that includes both the first conductor portion and the second conductor portion.

In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

The present invention relates to a method of connecting circuit elements and a corresponding system for connecting circuit elements. The method includes providing a plurality of flexible circuit elements on a carrier element; forming a connecting structure. The formed connecting structure includes at least two contact points; and operative connections between each of the plurality of flexible circuit elements and the at least two contact points. The method further includes severing the operative connection between at least one of the plurality of flexible circuit elements and the at least two contact points.

A method for manufacturing a metal card includes: a step for forming a metal card by laminating a stack of sheets in which are stacked a plurality of sheets, centered on a metal sheet, including adhesive sheets having the same size as the metal sheet, an upper inlay sheet having a first antenna, and a lower inlay sheet having a second antenna; a step for forming a COB accommodation space, which can accommodate a COB, by milling a certain area of the metal card using computerized numerical control (CNC) machining; a step for forming a through-hole, which exposes the first antenna and the second antenna, by milling a COB contact point region of the COB accommodation space down to the lower inlay sheet; a step for electrically connecting the first antenna and the second antenna by dispensing a conductive elastic liquid into the through-hole; and a step for bidirectionally connecting the first antenna and the second antenna to the COB by attaching the COB within the COB accommodation space so that the COB contact point is connected by the conductive elastic liquid.

An RFID tag is provided as a wireless communication device for transmitting and receiving a communication signal. The RFID tag includes a base material, antenna patterns formed on the base material, an RFIC package that is a feeder circuit connected to the antenna patterns, and an LC resonance circuit that is adjacent to the antenna patterns and resonates at a frequency higher than the frequency of the communication signal.

This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.

A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.

Disclosed herein is an antenna device that includes a first coil pattern having at least first, second, and third turns. As viewed in a coil axis direction, each of the first, second, and third turns has an opening with a width larger in a first direction than in a second direction orthogonal to the first direction. The width of the opening of the second turn in the second direction is larger than a width of the opening of the first turn in the second direction. The width of the opening of the third turn in the second direction is larger than the width of the opening of the second turn in the second direction and smaller than a width of the opening of the first turn in the first direction.