Patent classifications
G08B13/2437
CONVERGENCE OF PERFORMANCE OF RFID DEVICES IN AN ELECTRONIC ARTICLE SURVEILLANCE SYSTEM
RFID devices for use in electronic surveillance article (“EAS”) systems may be differently configured, resulting in different performance at the operating frequency or range of frequencies of an EAS system. The performance of differently configured RFID devices may be converged or rendered substantially similar by testing the performance of such RFID devices in a range of frequencies. At least one of the RFID devices is reconfigured to converge the performance of the RFID devices in the range of frequencies if the performance of the RFID devices is not sufficiently similar. This may include changing the configuration of an antenna, an RFID chip, and/or a non-functional component of an RFID device and/or the location in which an RFID device is associated to an article. Differently configured RFID devices may all be manufactured from the same initial configuration, with different RFID devices being differently processed before incorporation in an EAS system.
Protected RFID antenna
In one embodiment, a method of manufacturing an RFID label includes providing a web structure comprising a dielectric layer and a metal layer; depositing a non-removable resist on the metal layer, the deposition of the non-removable resist defining an antenna; depositing a removable resist on the metal layer, the deposition of the removable resist defining connection pads for connecting an integrated circuit (IC) to the antenna; etching the metal layer to form the antenna and the connection pads; removing the removable resist from the metal layer to expose the connection pads; and attaching the IC to the connection pads.
Methods and systems for heat applied sensor tag
A method for configuring a sensor tag includes placing the sensor tag in a location on a garment or fabric to be affixed. The method may further include applying a heat source at a temperature to the sensor tag for a time period. The method may further include removing the heat source after the time period has elapsed. The method may further include removing a paper layer between an adhesive layer and the garment of fabric prior to placing the sensor taking in the location. The method may further include removing a top protective layer after removing the heat source.
NON-TRANSFERABLE RADIO FREQUENCY IDENTIFICATION LABEL OR TAG
A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.
METHODS AND SYSTEMS FOR HEAT APPLIED SENSOR TAG
A method for configuring a sensor tag includes placing the sensor tag in a location on a garment or fabric to be affixed. The method may further include applying a heat source at a temperature to the sensor tag for a time period. The method may further include removing the heat source after the time period has elapsed. The method may further include removing a paper layer between an adhesive layer and the garment of fabric prior to placing the sensor taking in the location. The method may further include removing a top protective layer after removing the heat source.
METHOD OF FABRICATION OF LOW-POWER ELECTRONIC TAPE FOR TRACKING ITEMS
A wireless communication tape, dispenser of the same and methods of usage of the wireless tape and the dispenser in asset tracking applications are disclosed. The wireless communication tape can be manufactured in an ultrathin form factor by laminating a stack of layers to impart functionality to the wireless communication tape. Methods of use and operation of the wireless communication tape are disclosed to save battery resources of the communication tape.
Non-transferable radio frequency identification label or tag
A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.
PROTECTED RFID ANTENNA
Manufacturing antennas for a dual tag by: providing a web structure having a dielectric layer between a first metal layer and a second metal layer; depositing a first resist on the first metal layer to define a radio frequency (RF) coil and a first electrode of an RF capacitor; depositing the first resist on the second metal layer to define a second electrode of the RF capacitor; depositing a second resist on the second metal layer to define connection pads for a near field antenna, wherein one of the first resist and the second resist on the second metal layer defines a far field antenna and the near field antenna; and etching the first and second metal layers to form the RF coil, the electrodes of the RF capacitor, the far field antenna, the near field antenna, and the connection pads.
REINFORCEMENT ELEMENT AND METHOD FOR PRODUCING A REINFORCEMENT ELEMENT
A reinforcing element, in particular for shoes, bags or orthopedic applications, comprises a support layer and a cover layer. A memory element such as a RFID chip, is arranged between the support layer and the cover layer. Also, a manufacturing method for such a reinforcing element.
Non-transferable radio frequency identification label or tag
A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.