Patent classifications
G11B33/1413
Modular rack sized data storage tape library with hermetically sealed tape compartment
A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.
PROVIDING CONTINUOUS COOLING TO A STORAGE RACK
A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.
System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid
A system for cooling hard disk drives (HDDs) includes: an enclosure having (i) a lower volume within which a cooling liquid is heated to a boiling point to cause some of the cooling liquid to evaporate, creating a plume of rising vapor and (ii) an upper volume having (a) a HDD cooling area with HDD(s) placed in the direct path of the rising vapor, which cools the HDD(s) during functional operation of the HDD(s) and (b) a condenser located above the HDD cooling area and which cools a substantial portion of the rising vapor that impacts the condenser within the upper volume such that the rising vapor condenses back into liquid phase on contact with the condenser; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature.
Self latching cooling assembly
A cooling assembly includes a panel defining an opening, a cooling unit including an output and coupled to the panel such that the output at least partially covers the opening of the panel, and spring-loaded latch assemblies coupled to the panel and configured to couple the cooling assembly to an enclosure.
Providing continuous cooling to a storage rack
A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.
SYSTEM AND METHOD FOR COOLING STORAGE OR ACCELERATOR DEVICES
A chassis may include a member. The member may include a system channel for a liquid coolant to flow and a slot in the member for a storage device. A liquid cooling block may be associated with the slot in the member. The liquid cooling block may include a block channel for the liquid coolant to flow to remove heat from the storage device.
Data storage device (DSD) and cooling system for DSD chassis
A system includes a data storage drive having a housing with one or more data storage media therein. The housing includes a top cover and a base-deck. The base-deck includes a floor and a frame having a plurality of sides. The data storage drive also includes a printed circuit board assembly (PCBA) mounted on an exterior of one of the plurality of sides of the frame.
DATA STORAGE DEVICE COOLING
A data storage device including a passive cooling system. The data storage device including an enclosure and a printed circuit board coupled to the enclosure. The data storage device also including a vapor chamber coupled to the printed circuit board and one or more heat pipes in fluid communication with the vapor chamber. The vapor chamber and one or more heat pipes including a two-phase liquid therein and defining a thickness of less than or equal to 0.7 mm. The two-phase liquid dissipating heat within the data storage device by evaporating and condensing. In some embodiments, the data storage device also including a disk separator positioned between adjacent recording disks and acting similar to the vapor chamber.
Thermally Conductive Non-Oil Bleed Liquid Thermal Interface Materials
A liquid thermal interface material (LTIM) utilized in electronic devices includes a first part and a second part, where the first and second parts of the LTIM are individually synthesized. The first part and the second part are mixed together, dispensed into an electronic device, and the LTIM is at least partially cured. The first part comprises a dimethylpolysiloxane comprising resin, an oxide filler, a nitride filler, a catalyst comprising platinum, and a cyclohexanol comprising inhibitor. The second part comprises a polydimethylsiloxane comprising chain extender, a polymethylhydrosiloxane comprising crosslinker, a methylpolysiloxane comprising adhesive agent, the oxide filler, and the nitride filler. The cured LTIM has a thermal conductivity between about 4.5 W/mK to about 5.5 W/mK and a density less than about 2 g/cc. The cured LTIM does not bleed oil, thereby preventing contamination and damage of the electronic device.
DATA STORAGE DEVICE (DSD) AND COOLING SYSTEM FOR DSD CHASSIS
A system includes a data storage drive having a housing with one or more data storage media therein. The housing includes a top cover and a base-deck. The base-deck includes a floor and a frame having a plurality of sides. The data storage drive also includes a printed circuit board assembly (PCBA) mounted on an exterior of one of the plurality of sides of the frame.