A data storage array has a backplane at the base of an enclosure. A plurality of data storage drives are coupled to connectors of the backplane. A hot-swappable protocol expander module is coupled between the drives and the backplane through a top of the enclosure or to the backplane through a side of the enclosure.

A thermally and structurally optimized disaster resistant housing for a vertically stacked array of computer digital data storage devices such as hard drives is provided. An external, fire resistant housing has an internally mounted water resistant enclosure for the array. The water resistant enclosure includes a plurality of much thicker plates than known which significantly increase dissipation of heat and simultaneously greater increase the crush and impact load resistance of the device. An automatic method is also provided for producing complex molded gypsum or cement components.

A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.

An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

A metamaterial heat spreader includes a base, and a projection. The base is configured to be attached to a first surface of a heat generation component. The projection is continuous with and extends away from the base such that the projection is configured to be spaced apart from and overlap a second surface of the heat generation component. The projection is constituted by a metal with a periodic pattern. The projection is configured to have a high impedance surface (HIS).

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

According to one embodiment, a magnetic recording and reproducing device includes a perpendicular magnetic recording medium, a perpendicular magnetic recording head, a thermal assisted magnetic recording medium, and a thermal assisted magnetic recording head.