A device for manufacturing an n-layered optical information carrier having an injection molding unit for manufacturing a carrier body with a first information layer, and furthermore, a first embossing unit for manufacturing a second information layer. The second information layer has an input via which information carriers can be received in the embossing unit. The embossing unit moreover has an output unit via which the coated information carriers are output. (n−2) additional embossing units are associated with the device, for manufacturing in each case an additional information layer, wherein “n” is greater than two. The respective units are linked to one another so that the n-layered information carrier is manufactured in an inline manufacturing. The (n−2) additional embossing units can be coupled to and uncoupled from the device, wherein the additional embossing units in each case have an input and an output unit.

A method for taking, placing and conveying materials includes taking materials: a clamping device of a mechanical gripper is controlled by a control cabinet to move onto a storage cabinet to open a storage unit and to take materials away; placing the materials: the control cabinet controls processing units of a processing bin to open, the clamping device places the materials on the processing units, and the processing units are closed; processing the materials: the materials are processed by the processing units; and collecting the materials: the control cabinet controls the processing units of the processing bin to open, and the materials on the processing units are taken away by the clamping device and are placed back into the storage unit of the storage cabinet. The method for taking, placing and conveying materials is highly automated low in labor intensity, and high in work efficiency.

A multi-axis mechanical gripper includes a bottom moving mechanism, a vertical moving mechanism slidably connected to the bottom moving mechanism, horizontal moving mechanisms slidably connected to the vertical moving mechanism, and clamping devices slidably connected to the horizontal moving mechanisms and used for clamping materials. The clamping devices can be adjusted to the position of to-be-clamped materials through the cooperation of the bottom moving mechanism, the vertical moving mechanism and the horizontal moving mechanisms. The mechanical gripper is able to move along multiple axes, thereby being high in transfer efficiency, simple in structure, high in automation degree and capable of effectively relieving the labor intensity of workers.

A device for manufacturing an n-layered optical information carrier having an injection molding unit for manufacturing a carrier body with a first information layer, and furthermore, a first embossing unit for manufacturing a second information layer. The second information layer has an input via which information carriers can be received in the embossing unit. The embossing unit moreover has an output unit via which the coated information carriers are output. (n2) additional embossing units are associated with the device, for manufacturing in each case an additional information layer, wherein n is greater than two. The respective units are linked to one another so that the n-layered information carrier is manufactured in an inline manufacturing. The (n2) additional embossing units can be coupled to and uncoupled from the device, wherein the additional embossing units in each case have an input and an output unit.

A recording medium production device includes a substrate positioning pin vertically movable that performs positioning to a center-hole of a substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold the substrate; a cleaner having a gas ejection portion that ejects gas toward the surface of the substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward. The fixing portion is configured so as not to contact an inner circumferential side surface of the center-hole of substrate. The substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate, and presses and fixes the substrate positioning pin. Then the cleaner performs ejection and suction of gas.

A sputtering device capable of satisfying various requirements is provided. The sputtering device includes a rotation and revolution table, multiple sputtering targets, an RF plasma source, and a load-lock chamber 102. The rotation and revolution table is arranged inside a pressure-reducible container 101 and is rotatable by independent control. The multiple sputtering targets are arranged on a revolution orbit of the rotation and revolution table so as to correspond to multiple workpieces 107 to be set on the rotation and revolution table. The RF plasma source performs plasma treatment. The load-lock chamber 102 is used for setting the multiple workpieces on the rotation and revolution table. The rotation and revolution table is configured by arranging multiple rotation mounts 105 on a revolution table 104, and the rotations of the revolution table 104 and the multiple rotation mounts 105 are independently controllable.

There is provided an optical recording medium including: three reproduction layers, wherein reflectance R1, R2, and R3 of the three reproduction layers on a side of a surface irradiated with reproduction light is equal to or greater than 5%, and wherein any absolute value of a difference delta R between two selected from the reflectance R1, R2, and R3 is equal to or less than 7%.