G11C11/408

APPARATUSES AND METHODS FOR COUNTERING MEMORY ATTACKS
20230047007 · 2023-02-16 · ·

Aggressor rows may be detected by comparing access count values of word lines to a threshold value. Based on the comparison, a word line may be determined to be an aggressor row. The threshold value may be dynamically generated, such as a random number generated by a random number generator. In some examples, a random number may be generated each time an activation command is received. Responsive to detecting an aggressor row, a targeted refresh operation may be performed.

MEMORY ARRAY CIRCUIT, MEMORY ARRAY LAYOUT AND VERIFICATION METHOD
20230050097 · 2023-02-16 ·

Embodiments of the present application provide a memory array circuit, a memory array layout and a verification method. The memory array circuit includes: M word lines (WLs); M WL break nodes, each being configured to separate a corresponding one of the WLs into a first WL pin and a second WL pin; N bit lines (BLs); and N BL break nodes, each being configured to separate a corresponding one of the BLs into a first BL pin and a second BL pin, wherein the M and the N each are a positive even number.

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/output (I/O) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local I/O line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.

Memory device having 2-transistor vertical memory cell

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell, first, second, and third data lines, and first and second access lines. Each of the first, second, and third data lines includes a length extending in a first direction. Each of the first and second access lines includes a length extending in a second direction. The memory cell includes a first transistor including a charge storage structure, and a first channel region electrically separated from the charge storage structure, and a second transistor including a second channel region electrically coupled to the charge storage structure. The first data line is electrically coupled to the first channel region. The second data line is electrically coupled to the first channel region. The third data line is electrically coupled to the second channel region, the second channel region being between the charge storage structure and the third data line. The first access line is located on a first level of the apparatus and separated from the first channel by a first dielectric. The second access line is located on a second level of the apparatus and separated from the second channel by a second dielectric. The charge storage structure is located on a level of the apparatus between the first and second levels.

Searchable array circuits with load-matched signals for reduced hit signal timing margins and related methods

A CAM array of compare memory cell circuits includes a decode column corresponding to each set, and each set includes at least one row of the compare memory cell circuits. Each decode column receives a set clock signal addressing the corresponding set and generates a set match signal in each row of the corresponding set. A column compare circuit generates compare data indicating a bit of a compare tag. A row match circuit generates, for each row, in response to the set match signal, a row match signal indicating the compare tag matches the binary tag stored in the row. Circuits and loads in a decode column employed to generate the set clock signal correspond to circuits generating the row match signal in each column of the CAM array to reduce a timing margin of the match indication and decrease the access time for the CAM array.

Sub-sense amplifier layout scheme to reduce area

A sub-sense amplifier includes a semiconductor substrate, a first pair of complementary transistors, a second pair of complementary transistors, and at least one ground transistor. The first pair and second pair of complementary transistors and the ground transistor are formed on the semiconductor substrate. The first pair of complementary transistors are disposed in line symmetry with a center line of the sub-sense amplifier as a symmetry axis, and gates of the first pair of complementary transistors are coupled to a node. The second pair of complementary transistors are also disposed in line symmetry with the center line, wherein the current directions of the second pair of complementary transistors are the same. Sources and drains of the first pair of complementary transistors are coupled to gates and sources of the second pair of complementary transistors, respectively. The ground transistor connects in series with the second pair of complementary transistors.

MEMORY DEVICE AND MEMORY SYSTEM
20230042955 · 2023-02-09 ·

A memory device includes memory cells connected to a first word-line, wherein the memory cells include a data region in which data is stored and a counting value backup region in which the number of times the first word-line is activated is backed up, a counting table for storing a first row address corresponding to the first word-line and a first counting value as a counting result of the number of times the first word-line is activated, and a comparator configured to compare the first counting value with a first backed-up counting value stored in the counting value backup region; and when the first counting value is greater than the first backed-up counting value, back up the first counting value in the counting value backup region, or when the first backed-up counting value is greater than the first counting value, overwrite the first backed-up counting value into the counting table.

Memory power coordination

The present disclosure includes apparatuses and methods related to bank coordination in a memory device. A number of embodiments include a method comprising concurrently performing a memory operation by a threshold number of memory regions, and executing a command to cause a budget area to perform a power budget operation associated with the memory operation.

Memory power coordination

The present disclosure includes apparatuses and methods related to bank coordination in a memory device. A number of embodiments include a method comprising concurrently performing a memory operation by a threshold number of memory regions, and executing a command to cause a budget area to perform a power budget operation associated with the memory operation.

MEMORY AND METHOD FOR WRITING MEMOERY
20230008991 · 2023-01-12 · ·

A memory includes a bank, the bank includes a plurality of sections, each of the plurality of section includes a plurality of word lines, a plurality of bit lines, and a plurality of storage units arranged in an array, and each of the plurality of storage units is connected to one of the plurality of word lines and one of the plurality of bit lines; the bank is configured to: in a preset mode, in response to a control signal, activate each of a plurality of word lines in at least one target section of the bank, pull up or pull down a level of each of a plurality of bit lines in the target section, and pull a complementary bit line of each of the plurality of bit lines in the target section to a level opposite to a level of the plurality of bit lines.