Embodiments of the present application relate to the field of semiconductors, and provide an amplifier and a memory. The amplifier includes at least a sense amplifier, where the sense amplifier includes a pull-up driving circuit and an amplifier circuit; the pull-up driving circuit includes one terminal connected to a power supply voltage, and the other terminal connected to a power supply terminal of the amplifier circuit; the sense amplifier includes a first sense amplifier and a second sense amplifier; the first sense amplifier includes a first pull-up driving circuit and a first amplifier circuit; the second sense amplifier includes a second pull-up driving circuit and a second amplifier circuit; and both the first pull-up driving circuit and the second pull-up driving circuit are located between the first amplifier circuit and the second amplifier circuit. The embodiments of the present application are helpful to improve the layout design of the amplifier.

Embodiments of the present application relate to the field of semiconductors, and provide an amplifier and a memory. The amplifier includes at least a sense amplifier, where the sense amplifier includes a pull-up driving circuit and an amplifier circuit; the pull-up driving circuit includes one terminal connected to a power supply voltage, and the other terminal connected to a power supply terminal of the amplifier circuit; the sense amplifier includes a first sense amplifier and a second sense amplifier; the first sense amplifier includes a first pull-up driving circuit and a first amplifier circuit; the second sense amplifier includes a second pull-up driving circuit and a second amplifier circuit; and both the first pull-up driving circuit and the second pull-up driving circuit are located between the first amplifier circuit and the second amplifier circuit. The embodiments of the present application are helpful to improve the layout design of the amplifier.

A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/output (I/O) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local I/O line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.

A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/output (I/O) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local I/O line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.

The present disclosure provides a sense amplification circuit and a method of reading out data, including: a first PMOS transistor; a first NMOS transistor; a second PMOS transistor; a second NMOS transistor; a first control MOS transistor configured to provide a bias voltage to the first PMOS transistor according to a control signal; a second control MOS transistor configured to provide the bias voltage to the second PMOS transistor according to the control signal; a first offset cancellation MOS transistor configured to electrically connect an initial bit line to a first complementary readout bit line according to an offset cancellation signal; and a second offset cancellation MOS transistor configured to electrically connect an initial complementary bit line to a first readout bit line according to the offset cancellation signal.

The present disclosure provides a sense amplification circuit and a method of reading out data, including: a first PMOS transistor; a first NMOS transistor; a second PMOS transistor; a second NMOS transistor; a first control MOS transistor configured to provide a bias voltage to the first PMOS transistor according to a control signal; a second control MOS transistor configured to provide the bias voltage to the second PMOS transistor according to the control signal; a first offset cancellation MOS transistor configured to electrically connect an initial bit line to a first complementary readout bit line according to an offset cancellation signal; and a second offset cancellation MOS transistor configured to electrically connect an initial complementary bit line to a first readout bit line according to the offset cancellation signal.

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell, first, second, and third data lines, and first and second access lines. Each of the first, second, and third data lines includes a length extending in a first direction. Each of the first and second access lines includes a length extending in a second direction. The memory cell includes a first transistor including a charge storage structure, and a first channel region electrically separated from the charge storage structure, and a second transistor including a second channel region electrically coupled to the charge storage structure. The first data line is electrically coupled to the first channel region. The second data line is electrically coupled to the first channel region. The third data line is electrically coupled to the second channel region, the second channel region being between the charge storage structure and the third data line. The first access line is located on a first level of the apparatus and separated from the first channel by a first dielectric. The second access line is located on a second level of the apparatus and separated from the second channel by a second dielectric. The charge storage structure is located on a level of the apparatus between the first and second levels.

Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

An apparatus including a temperature dependent circuit is configured to receive a temperature dependent power supply voltage, and further is configured to receive a first input signal and provide a temperature dependent output signal responsive to the input signal. A power control circuit including the temperature dependent circuit is configured to receive a second input signal, and further configured provide a first control voltage based on the first temperature dependent output signal and provide a second control voltage based on the second input signal. The second control voltage has a temperature dependency based on the temperature dependent power supply voltage. A sense amplifier coupled to a pair of digit lines is configured to receive the first and second control voltages and amplify a voltage difference between the digit lines of the pair.