Embodiments of the present application relate to the field of semiconductors, and provide an amplifier and a memory. The amplifier includes at least a sense amplifier, where the sense amplifier includes a pull-up driving circuit and an amplifier circuit; the pull-up driving circuit includes one terminal connected to a power supply voltage, and the other terminal connected to a power supply terminal of the amplifier circuit; the sense amplifier includes a first sense amplifier and a second sense amplifier; the first sense amplifier includes a first pull-up driving circuit and a first amplifier circuit; the second sense amplifier includes a second pull-up driving circuit and a second amplifier circuit; and both the first pull-up driving circuit and the second pull-up driving circuit are located between the first amplifier circuit and the second amplifier circuit. The embodiments of the present application are helpful to improve the layout design of the amplifier.

Embodiments of the present application relate to the field of semiconductors, and provide an amplifier and a memory. The amplifier includes at least a sense amplifier, where the sense amplifier includes a pull-up driving circuit and an amplifier circuit; the pull-up driving circuit includes one terminal connected to a power supply voltage, and the other terminal connected to a power supply terminal of the amplifier circuit; the sense amplifier includes a first sense amplifier and a second sense amplifier; the first sense amplifier includes a first pull-up driving circuit and a first amplifier circuit; the second sense amplifier includes a second pull-up driving circuit and a second amplifier circuit; and both the first pull-up driving circuit and the second pull-up driving circuit are located between the first amplifier circuit and the second amplifier circuit. The embodiments of the present application are helpful to improve the layout design of the amplifier.

Embodiments of the present application provide a memory array circuit, a memory array layout and a verification method. The memory array circuit includes: M word lines (WLs); M WL break nodes, each being configured to separate a corresponding one of the WLs into a first WL pin and a second WL pin; N bit lines (BLs); and N BL break nodes, each being configured to separate a corresponding one of the BLs into a first BL pin and a second BL pin, wherein the M and the N each are a positive even number.

Embodiments of the present application provide a memory array circuit, a memory array layout and a verification method. The memory array circuit includes: M word lines (WLs); M WL break nodes, each being configured to separate a corresponding one of the WLs into a first WL pin and a second WL pin; N bit lines (BLs); and N BL break nodes, each being configured to separate a corresponding one of the BLs into a first BL pin and a second BL pin, wherein the M and the N each are a positive even number.

The present disclosure provides a sense amplification circuit and a method of reading out data, including: a first PMOS transistor; a first NMOS transistor; a second PMOS transistor; a second NMOS transistor; a first control MOS transistor configured to provide a bias voltage to the first PMOS transistor according to a control signal; a second control MOS transistor configured to provide the bias voltage to the second PMOS transistor according to the control signal; a first offset cancellation MOS transistor configured to electrically connect an initial bit line to a first complementary readout bit line according to an offset cancellation signal; and a second offset cancellation MOS transistor configured to electrically connect an initial complementary bit line to a first readout bit line according to the offset cancellation signal.

Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

An apparatus including a temperature dependent circuit is configured to receive a temperature dependent power supply voltage, and further is configured to receive a first input signal and provide a temperature dependent output signal responsive to the input signal. A power control circuit including the temperature dependent circuit is configured to receive a second input signal, and further configured provide a first control voltage based on the first temperature dependent output signal and provide a second control voltage based on the second input signal. The second control voltage has a temperature dependency based on the temperature dependent power supply voltage. A sense amplifier coupled to a pair of digit lines is configured to receive the first and second control voltages and amplify a voltage difference between the digit lines of the pair.

An apparatus including a temperature dependent circuit is configured to receive a temperature dependent power supply voltage, and further is configured to receive a first input signal and provide a temperature dependent output signal responsive to the input signal. A power control circuit including the temperature dependent circuit is configured to receive a second input signal, and further configured provide a first control voltage based on the first temperature dependent output signal and provide a second control voltage based on the second input signal. The second control voltage has a temperature dependency based on the temperature dependent power supply voltage. A sense amplifier coupled to a pair of digit lines is configured to receive the first and second control voltages and amplify a voltage difference between the digit lines of the pair.

A memory device includes a page made up of plural memory cells arranged in a column on a substrate. A page write operation is performed to hold positive hole groups generated by an impact ionization phenomenon, in a channel semiconductor layer by controlling voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity layer, and a second impurity layer of each memory cell contained in the page and a page erase operation is performed to remove the positive hole groups out of the channel semiconductor layer by controlling voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity layer, and the second impurity layer. The first impurity layer of the memory cell is connected with a source line, the second impurity layer is connected with a bit line, one of the first gate conductor layer and the second gate conductor layer is connected with a word line, and another is connected with a drive control line. The bit line is connected to a sense amplifier circuit via a switch circuit. At least one of word lines is selected and a refresh operation is performed to return the voltage of the channel semiconductor layer of the selected word line to the first data retention voltage by controlling voltages applied to the selected word line, the drive control line, the source line, and the bit line and thereby forming the positive hole groups by an impact ionization phenomenon in the channel semiconductor layer of the memory cell in which the voltage of the channel semiconductor layer is set to the first data retention voltage using the page write operation. The refresh operation is performed, with the switch circuit kept in a nonconducting state, concurrently with a page read operation of reading page data of a first memory cell group belonging to a first page into the sense amplifier circuit.