G11C14/009

TWO-LEVEL SYSTEM MAIN MEMORY
20180004432 · 2018-01-04 ·

Embodiments of the invention describe a system main memory comprising two levels of memory that include cached subsets of system disk level storage. This main memory includes “near memory” comprising memory made of volatile memory, and “far memory” comprising volatile or nonvolatile memory storage that is larger and slower than the near memory.

The far memory is presented as “main memory” to the host OS while the near memory is a cache for the far memory that is transparent to the OS, thus appearing to the OS the same as prior art main memory solutions. The management of the two-level memory may be done by a combination of logic and modules executed via the host CPU. Near memory may be coupled to the host system CPU via high bandwidth, low latency means for efficient processing. Far memory may be coupled to the CPU via low bandwidth, high latency means.

Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
11711082 · 2023-07-25 · ·

A multi-chip package includes a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table, wherein the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip comprises multiple non-volatile memory cells therein configured to store multiple resulting values of the truth table, and a programmable logic block therein configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output; and a memory chip coupling to the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip, wherein a data bit width between the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip and the memory chip is greater than or equal to 64.

CES-BASED LATCHING CIRCUITS

According to one embodiment of the present disclosure, a device comprises a latching circuitry, where the latching circuitry comprises at least one correlated electron random access memory (CeRAM) element. The latching circuitry further comprises a control circuit coupled to the at least one CeRAM element. The control circuit is configured to receive at least one control signal. Based on the at least one control signal, perform at least one of storing data into the latching circuitry and outputting data from the latching circuitry.

PHASE-CHANGE MEMORY DEVICES, SYSTEMS, AND METHODS OF OPERATING THEREOF
20230005534 · 2023-01-05 · ·

In certain aspects, a memory device includes a bit line, a plurality of memory cells coupled with the bit line, and N selectors, where N is a positive integer greater than 1, and N word lines. Each one of the plurality of memory cells includes N phase-change memory (PCM) elements. Each one of the N selectors is coupled with a respective one of the N PCM elements. Each one of the N word lines is coupled with a respective one of the N selectors.

3-D crossbar architecture for fast energy-efficient in-memory computing of graph transitive closure

An in-memory computing architecture is disclosed that can evaluate the transitive closure of graphs using the natural parallel flow of information in 3-D nanoscale crossbars. The architecture can be implemented using 3-D crossbar architectures with as few as two layers of 1-diode 1-resistor (1D1R) interconnects. The architecture avoids memory-processor bottlenecks and can hence scale to large graphs. The approach leads to a runtime complexity of O(n.sup.2) using O(n.sup.2) memristor devices. This compares favorably to conventional algorithms with a time complexity of O((n.sup.3)/p+(n.sup.2) log p) on p processors. The approach takes advantage of the dynamics of 3-D crossbars not available on 2-D crossbars.

3D cross-bar nonvolatile memory

Semiconductor structures and methods for crystalline junctionless transistors used in nonvolatile memory arrays are introduced. Various embodiments in accordance with this disclosure provide a method of fabricating a monolithic 3D cross-bar nonvolatile memory array with low thermal budget. The method incorporates crystalline junctionless transistors into nonvolatile memory structures by transferring a layer of doped crystalline semiconductor material from a seed wafer to form the source, drain, and connecting channel of the junctionless transistor.

Phase change memory in a dual inline memory module

Subject matter disclosed herein relates to management of a memory device.

Integrated circuit devices and methods of manufacturing same

An integrated circuit (IC) device may include a single substrate that includes a single chip, and a plurality of memory cells spaced apart from one another on the substrate and having different structures. Manufacturing the IC device may include forming a plurality of first word lines in a first region of the substrate, and forming a plurality of second word lines in or on a second region of the substrate. Capacitors may be formed on the first word lines. Source lines may be formed on the second word lines. An insulation layer that covers the plurality of capacitors and the plurality of source lines may be formed in the first region and the second region. A variable resistance structure may be formed at a location spaced apart from an upper surface of the substrate by a first vertical distance, in the second region.

NON-VOLATILE MEMORY BASED COMPUTE-IN-MEMORY CELL
20230162785 · 2023-05-25 ·

A memory device including a static random-access memory that includes two cross-coupled inverters and an access transistor having a gate connected to a word line. The memory device further includes one or more logic gates electrically coupled to the static random-access memory, and a non-volatile memory electrically coupled to the static random-access memory and configured to store data and be read using the static random-access memory, wherein the non-volatile memory is connected on one side to the access transistor and on another side to the two cross-coupled inverters.

MEMORY CONTROLLER, AND MEMORY MODULE AND PROCESSOR INCLUDING THE SAME
20170352403 · 2017-12-07 ·

A memory controller of a memory device that uses a phase change memory and includes a memory cell array partitioned into a plurality of partitions is provided. A write request that request a data write to the memory device and a read request which request a data read from the memory device are inserted to a request queue. A scheduler, in a case that a conflict check condition including a first condition that a write operation is being performed in a first partition among the plurality of partitions is satisfied, creates a read command for a second partition based on a read request for the second partition when the request queue includes the read request for the second partition. The second partition is a partition, in which a read operation does not conflict with the write operation in the first partition, among the plurality of partitions.