An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.

A memory apparatus and method of operation are provided. The apparatus includes apparatus including memory cells connected to word lines including at least one dummy word line and data word lines. The memory cells are arranged in strings and are configured to retain a threshold voltage. The apparatus also includes a control means coupled to the word lines and the strings and configured to identify ones of the memory cells connected to the at least one dummy word line with the threshold voltage being below a predetermined detection voltage threshold following an erase operation. The control means is also configured to selectively apply at least one programming pulse of a maintenance program voltage to the at least one dummy word line to program the ones of the memory cells connected to the at least one dummy word line having the threshold voltage being below the predetermined detection voltage threshold.

An eFuse cell is provided. The eFuse cell may include a first PMOS transistor and a first NMOS transistor configured to receive a programmed state selection (BLOWB) signal, a second PMOS transistor and a second NMOS transistor configured to receive a write word line bar (WWLB) for a program operation, a first read NMOS transistor and a second read NMOS transistor configured to receive a read word line (RWL) for a read operation, a program transistor configured to control a program current to flow for a fusing operation, and an eFuse connected between the first read NMOS transistor and the second read NMOS transistor.

In a method of operating one or more nonvolatile memory devices including one or more memory blocks, each memory block includes a plurality of memory cells and a plurality of pages arranged in a vertical direction. Pages arranged in a first direction of a channel hole are set as first to N-th pages. A size of the channel hole increases in the first direction and decreases in the second direction. Pages arranged in a second direction of the channel hole are set as (N+1)-th to 2N-th pages. First to N-th page pairs are set such that a K-th page among the first to the N-th pages and an (N+K)-th page among the (N+1)-th to 2N-th pages form one page pair. Parity regions of two pages included in at least one page pair are shared by the two pages included in the at least one page pair.

A storage device that includes a non-volatile memory with a control circuitry is provided. The control circuitry is communicatively coupled to a memory block that includes an array of memory cells. The control circuitry is configured to program one or more bits of data into the memory cells. The control circuitry is further configured to operate the non-volatile memory in a multi-bit per memory cell mode, monitor a usage metric while the non-volatile memory is operating in the multi-bit per memory cell mode, and determine if the usage metric has crossed a predetermined threshold. In response to the usage metric not crossing the predetermined threshold, the control circuitry continues to operate the non-volatile memory in the multi-bit per memory cell mode. In response to the usage metric crossing the predetermined threshold, the control circuitry automatically operates the non-volatile memory in a single-bit per memory cell mode.

A method includes performing a first write operation that writes data to a first memory unit of a group of memory units in a memory device, determining a write-to-write (W2W) delay based on a time difference between the first write operation and a second write operation on a memory unit in the group of memory units, wherein the second write operation occurred prior to the first write operation, identifying a threshold time criterion that is satisfied by the W2W delay, identifying a first read voltage level associated with the threshold time criterion, and associating the first read voltage level with a second memory unit of the group of memory units. The second memory unit can be associated with a second read voltage level that satisfies a selection criterion based on a comparison of the second read voltage level to the first read voltage level.

A semiconductor memory device includes a memory cell array, a peripheral circuit, and a control logic. The memory cell array includes a plurality of memory cells. The peripheral circuit performs a program operation on selected memory cells among the plurality of memory cells. The control logic controls the program operation of the peripheral circuit. The program operation includes a plurality of program loops. The control logic is configured to control the peripheral circuit to apply a program voltage to a select word line that is connected to the selected memory cells, apply a first under drive voltage that is determined based on at least one verify voltage to the select word line, and apply the at least one verify voltage to the select word line in each of the plurality of program loops. The first under drive voltage is at a lower voltage level than the at least one verify voltage.

A storage device includes 3D NAND including layers of multi-level cells. Test reads are performed by reading only LSB pages and reading layers in a repeating pattern of reading two and skipping two. A test read of a block is performed when its read count reaches a threshold. The counter threshold is updated according to errors detected during the test read such that the frequency of test reads increases with increase in errors detected. Counter thresholds according to errors may be specified in a table. The table may be selected as corresponding to a range of PEC values including the current PEC count of the 3D NAND. Each table further specifies a number of errors that will result in garbage collection being performed.

The present technology relates to an electronic device. A memory device that controls a voltage applied to each line to prevent or mitigate a channel negative boosting phenomenon during a sensing operation includes a memory block connected to a plurality of lines, a peripheral circuit configured to perform a sensing operation on selected memory cells connected to a selected word line among the plurality of lines, and control logic configured to control voltages applied to drain select lines, source select lines, and word lines between the drain select lines and the source select lines among the plurality of lines, during the sensing operation and an equalizing operation performed after the sensing operation. The control logic controls a voltage applied to an unselected drain select line according to whether a cell string is shared with a selected drain select line among the drain select lines, during the sensing operation.

A memory controller receives a command to program information to a memory storage array controlled by the memory controller. The memory controller determines a target memory state to store the information, and a target threshold voltage level corresponding to the target memory state. Based at least on the target memory state, the memory controller determines one or more program pulses for a pre-program cycle, including voltage levels for the one or more program pulses based at least on the target threshold voltage level. The memory controller selects a memory location in the memory storage array to program the information, and pre-programs the selected memory location by applying the one or more program pulses at respective voltage levels, the one or more program pulses applied without program verify operations. Following the pre-programming, the memory controller programs the information to the selected memory location.