Methods, systems, and devices for voltage regulation distribution for stacked memory are described. A stacked memory device may support various techniques for coupling between voltage regulation circuitry of multiple memory dies, or for coupling of voltage regulation circuitry of some memory dies with circuitry associated with operating memory arrays of other memory dies. In some examples, such techniques may include cross-coupling of voltage regulation circuitry based on access activity or a degree of access activity for array circuitry. In some examples, such techniques may include isolating voltage regulation circuitry based on access activity or a degree of access activity for array circuitry. Dynamic coupling or isolation between voltage regulation circuitry may be supported by various signaling related to a stacked memory device, such as signaling between the stacked memory dies, signaling between a memory die and a central controller, or signaling between the stacked memory device and a host device.

Integrated circuit devices might include a voltage regulator comprising an input and an output, a selectively activated current path connected between the input and output, and a controller configured to cause the integrated circuit device to connect the output to the input through the current path when a voltage level of the input has a first voltage level, maintain the connection of the output and the input through the current path until the voltage level of the input has a second voltage level higher than the first voltage level, isolate the output from the input through the current path after the voltage level of the input has the second voltage level, and regulate a voltage level of the output while the output is isolated from the input through the current path.

Integrated circuit devices might include a voltage regulator comprising an input and an output, a selectively activated current path connected between the input and output, and a controller configured to cause the integrated circuit device to connect the output to the input through the current path when a voltage level of the input has a first voltage level, maintain the connection of the output and the input through the current path until the voltage level of the input has a second voltage level higher than the first voltage level, isolate the output from the input through the current path after the voltage level of the input has the second voltage level, and regulate a voltage level of the output while the output is isolated from the input through the current path.

The present technology relates to an electronic device. According to the present technology, a memory device having improved verify accuracy may include a memory block including memory cells, a read and write circuit including a plurality of page buffers, a current sensing circuit configured to perform a verify operation of comparing sensing voltages with a reference voltage, and a control logic configured to control the current sensing circuit to perform the verify operation. The control logic controls performing a first verify operation on each of page buffer groups having a same logical group number, and performing a second verify operation on each of page buffer groups having a same physical group number, and the current sensing circuit outputs a verify pass signal in response to both results of the first verify operation and the second verify operation satisfying a pass criterion.

The present technology relates to an electronic device. According to the present technology, a memory device having improved verify accuracy may include a memory block including memory cells, a read and write circuit including a plurality of page buffers, a current sensing circuit configured to perform a verify operation of comparing sensing voltages with a reference voltage, and a control logic configured to control the current sensing circuit to perform the verify operation. The control logic controls performing a first verify operation on each of page buffer groups having a same logical group number, and performing a second verify operation on each of page buffer groups having a same physical group number, and the current sensing circuit outputs a verify pass signal in response to both results of the first verify operation and the second verify operation satisfying a pass criterion.

Apparatuses and methods including multiple read modes for reading data from a memory are described. An example apparatus includes a memory including a first read mode and a second read mode. The memory has a read operation for the first read mode including a first pre-access phase, an access phase, and a first post-access phase. The read operation for the second read mode includes a second pre-access phase, the access phase, and a second post-access phase. The read operation for either the first read mode or the second read mode is performed responsive to the memory receiving a read command. The second pre-access phase is different from the first pre-access phase, with the second pre-access phase having a shorter time than the first pre-access phase measured from receipt of the read command.

A semiconductor storage device includes a memory cell array, a peripheral circuit configured to perform writing of data to the memory cell array and reading of data from the memory cell array, and a sampling circuit configured to execute a sampling process by which sampling data is collected from a predetermined node of the peripheral circuit, during a period in which the peripheral circuit performs the writing of data to the memory cell array or the reading of data from the memory cell array.

Sensing devices might include a first voltage node configured to receive a first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, a p-type field-effect transistor (pFET) selectively connected to a data line, and a sense node selectively connected to the pFET. The pFET might be connected between the first voltage node and the data line, between the second voltage node and the data line, and between the first voltage node and the data line. Memories might have controllers configured to cause the memories to determine whether a memory cell has an intended threshold voltage using similar sensing devices.

Sensing devices might include a first voltage node configured to receive a first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, a p-type field-effect transistor (pFET) selectively connected to a data line, and a sense node selectively connected to the pFET. The pFET might be connected between the first voltage node and the data line, between the second voltage node and the data line, and between the first voltage node and the data line. Memories might have controllers configured to cause the memories to determine whether a memory cell has an intended threshold voltage using similar sensing devices.

An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.