A memory device includes a memory cell array including a plurality of memory cells on which a programming loop is executed a plurality of times; a voltage generator configured to apply a verifying voltage to the memory cells, for verifying at least one programming state of the memory cells; and a voltage controller configured to control the voltage generator to change a level of the verifying voltage as a program loop count increases, based on temperature information about a temperature inside or outside the memory device.

A memory device includes a memory cell array including a plurality of memory cells; a voltage generator configured to generate voltages used for a program operation and a verify operation for the memory cells; and control logic configured to perform a plurality of program loops while writing data to the memory cell array, such that first to N-th (e.g., N>=1) program loops including a program operation and a verify operation are performed and at least two program loops in which the verify operation is skipped are performed when a pass/fail determination of the program operation in the N-th program loop indicates a pass.

A memory device includes a controller that performs a program verification after a first program pulse is applied to the at least one non-volatile memory cell. The first program pulse is applied during a data program operation and the data program operation includes applying program pulses to program multi-bit data to the at least one non-volatile memory cell. The controller also determines a program mode for the at least one non-volatile memory cell based on a result of the program verification, and changes at least one of a level of a first control voltage based on the program mode. The first control voltage is applied to a drain select line coupled to the at least one non-volatile memory cell.

The disclosure is directed to a memory device with a leakage current verifying circuit for minimizing leakage current. In an aspect, the memory device includes not limited to a memory array, a leakage current verifying circuit, and a controller. The controller is configured to perform an erase operation for a first column of memory cells connected to a first WL, set a verify condition including a leakage current threshold, perform a leakage current verifying operation for the first column of the memory cells by comparing a leakage current of a cell of the first column of the memory cells to the leakage current threshold, detect a failure of the first column in response to a cell having the leakage current being above the leakage current threshold, and perform a post-program operation to repair the failure of the first column of the memory cells.

Weak erase detection and mitigation techniques are provided that detect permanent failures in solid-state storage devices. One exemplary method comprises obtaining an erase fail bits metric for a solid-state storage device; and detecting a permanent failure in at least a portion of the solid-state storage device causing weak erase failure mode by comparing the erase fail bit metric to a predefined fail bits threshold. In at least one embodiment, the method also comprises mitigating for the permanent failure causing the weak erase failure mode for one or more cells of the solid-state storage device. The mitigating for the permanent failure comprises, for example, changing a status of the one or more cells to a defective state and/or a retired state. The detection of the permanent failure causing the weak erase failure mode comprises, for example, detecting the weak erase failure mode without an erase failure.

A programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. A program verify operation is caused to be performed on the memory cell to determine that a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node associated with the memory cell. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell to reduce a rate of programming associated with the memory cell.

In a method of counting the number of memory cells in a nonvolatile memory device, a measurement range and a plurality of measurement intervals of a measurement window for a cell counting operation are set to a first range and a plurality of first intervals, respectively. The plurality of measurement intervals are included in the measurement range. A first sensing operation is performed on first memory cells included in a first region of a memory cell array based on the measurement window. A first shifting operation for shifting the measurement window is performed while a width of the measurement range and a width of each of the plurality of measurement intervals are maintained. A second sensing operation is performed on the first memory cells based on the measurement window shifted by the first shifting operation. A final count value for the first memory cells is obtained based on a result of the first sensing operation and a result of the second sensing operation.

Disclosed is a system, and a method of using the system, that includes a memory component and a processing device. The processing device provides, to a host system, a failure notification that includes an indication of memory cell(s) of the memory device storing a data that was corrupted during a memory operation. The processing device then receives a replacement data from the host system. The replacement data is provided in response to the host system identifying a range of logical addresses corresponding to the corrupted data, based on geometric parameters of the memory device and the failure notification.

An apparatus that includes a word line with a plurality of memory cells that are able to be programmed to a plurality of data states is provided. The apparatus further includes a programming circuit. The programming circuit is configured to program the memory cells and count the number of verify pulses at a first verify voltage level that are performed during programming of the memory cells to a first programmed data state to determine a verify count. During programming to a second data state, the programming circuit applies a plurality of programming pulses at increasing voltage levels and a plurality of verify pulses at a second verify voltage level to the selected word line. During programming of the memory cells to the second programmed data state, the number of verify pulses is one fewer than the number of programming pulses and bitscan operations are skipped.

An apparatus is described. The apparatus includes a non volatile memory chip. The non volatile memory chip includes an interface to receive access commands, a three dimensional array of non volatile storage cells, and, a controller to orchestrate removal of charge in a column of stacked ones of the non volatile storage cells after a verification process that determined whether or not a particular cell along the column was programmed with a correct charge amount. The removal of the charge pushes the charge out of the column by changing respective word line potentials along a particular direction along the column. Cells that are coupled to the column are programmed in the particular direction. Disturbance of neighboring cells during programming is less along the particular direction than a direction opposite that of the particular direction.