A system includes a plurality of memory dice and a processing device coupled to the plurality of memory dice. The processing device is to determine whether an error correcting code (ECC) check of ECC-protected data read from a die of the plurality of memory dice results in detecting an error. In response to detecting the error from the ECC-protected data, the processing device performs a confirmation check that the error is a result of a defect in the die. In response to the confirmation check confirming the die is defective, the processing device ignores a temperature value from the die when determining whether to trigger a thermal-related operation.

Embodiments of the present disclosure relate to solutions for introducing personalization data in nonvolatile memories of a plurality of integrated circuits, comprising writing in the nonvolatile memory of a given integrated circuit a static data image, corresponding to an invariant part of nonvolatile memory common to the plurality of integrated circuits, and a personalization data image representing data specific to the given integrated circuit.

An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a first circuit to generate a temperature-dependent voltage (TDV) that is dependent on an operating temperature of the integrated circuit, and a second circuit to generate a plurality of temperature reference voltages, based on or more codes. One or more comparator circuits compare individual ones of the plurality of reference voltages with the TDV, to generate one or more comparison signals that are indicative of the operating temperature of the integrated circuit.

A memory-testing circuit configured to perform a test of reference bits in a memory. In a read operation, outputs of data bit columns are compared with one or more reference bit columns. The memory-testing circuit comprises: a test controller and association adjustment circuitry configurable by the test controller to associate another one or more reference bit columns or one or more data bit columns with the data bit columns in the read operation. The test controller can determine whether the original one or more reference bit columns have a defect based on results from the two different association.

An operating method of a nonvolatile memory device for programming multi-page data, the operating method including: receiving the multi-page data from a memory controller; programming first page data among the multi-page data to first memory cells connected to a word line adjacent to a selected word line; reading previous page data previously stored in second memory cells connected to the selected word line based on a first sensing value and a second sensing value after programming the first page data, calculating a first fail bit number by comparing first bits of the previous page data read based on the first sensing value to second bits of the previous page data read based on the second sensing value; and programming the previous page data read from the second memory cells and second page data among the multi-page data to the second memory cells based on the first fail bit number.

An operating method of a nonvolatile memory device for programming multi-page data, the operating method including: receiving the multi-page data from a memory controller; programming first page data among the multi-page data to first memory cells connected to a word line adjacent to a selected word line; reading previous page data previously stored in second memory cells connected to the selected word line based on a first sensing value and a second sensing value after programming the first page data, calculating a first fail bit number by comparing first bits of the previous page data read based on the first sensing value to second bits of the previous page data read based on the second sensing value; and programming the previous page data read from the second memory cells and second page data among the multi-page data to the second memory cells based on the first fail bit number.

Methods, systems, and devices for defect detection for a memory device are described. A segmented digital die defect detector may include multiple signal lines, each coupled with a test circuit, and a control circuit to form a path. At least part of the path may extend through an internal portion of the die. A test circuit may generate a digital feedback signal that indicates a condition of a respective signal line. The control circuit may generate a single output signal, indicative of the condition of the signal lines. By utilizing digital testing circuitry and a single digital output signal, a layout area of the segmented digital die defect detector may be reduced and a power consumption associated with the testing operation may be reduced.

A system, computer readable medium and a method. The method may include sending input data to a NAND flash memory unit that comprises the NAND flash memory array and instructing the NAND flash memory unit to write input data to the NAND flash memory array to provide programmed data; reading from the NAND flash memory array the programmed data to provide read data; comparing the input data and the read data to provide column errors statistics at a column resolution; and defining, by a flash memory controller, bad columns of the NAND flash memory array in response to the column error statistics.

A method for predicting high-temperature operating life of an integrated circuit (IC) includes performing bias temperature instability tests and high-temperature operating life tests on a device of the IC, establishing a relationship between the device bias temperature instability and the IC's high-temperature operating life based on a result of the bias temperature instability tests and the high-temperature operating life tests. The method further includes providing a lot of subsequent integrated circuits (ICs), performing wafer-level bias temperature instability tests on a device of the ICs, and predicting high-temperature operating life of the ICs based on a result of the wafer-level bias temperature instability tests and based on the established relationship between the device's bias temperature instability and the IC's high-temperature operating life. The method can save significant effort and time over conventional approaches for accurate prediction of high-temperature operating life of an IC.

A method for detecting a reading error of a datum in memory. A binary word which is representative of the datum and an error correcting or detecting code is read by: reading a first part of the binary word stored at a first address in a first memory circuit; and reading a second part of the binary word stored at a second address in a second memory circuit. The first and second parts read from the first and second memory circuits, respectively, are concatenated to form a read binary word. The datum is then obtained by removing the error correcting or detecting code from the read binary word. A new error correcting or detecting code is calculated from the obtained datum and compared to the removed error correcting or detecting code to detect error in the obtained datum.