Apparatuses and methods for temperature and process corner sensitive control of power gated domains are described. An example apparatus includes an internal circuit; a power supply line; and a power gating control circuit which responds, at least in part, to a first change from a first state to a second state of a control signal to initiate supplying a power supply voltage from the power supply line to the internal circuit, and continue supplying the power supply voltage from the power supply line to internal circuit for at least a timeout period from a second change from the second state to the first state of the control signal, in which the timeout period represent temperature dependency.

An improved sensing circuit is disclosed that utilizes a bit line in an unused memory array to provide reference values to compare against selected cells in another memory array. A circuit that can perform a self-test for identifying bit lines with leakage currents about an acceptable threshold also is disclosed.

A memory device comprises a memory array; a word line driver circuit including a charge pump circuit configured to generate a program voltage target to be applied to a word line to program a memory cell of the memory array, and a control loop to activate the charge pump circuit using a control signal according to a comparison of a pump circuit output voltage to a specified duty cycle after the charge pump circuit output reaches the program voltage target, and provides an indication of current generated by the charge pump circuit according to the duty cycle; and logic circuitry that generates a fault indication when the current generated by the charge pump circuit is greater than a specified threshold current.

The present disclosure relates to integrated circuits, and more particularly, to a wordline system architecture supporting an erase operation and current-voltage (I-V) characterization and methods of manufacture and operation. In particular, the present disclosure relates to a structure including: a twin cell circuit which is connected to a wordline of a memory array; a sourceline driver which is connected to a sourceline of the memory array for providing a cell level current-voltage (I-V) access of the twin cell circuit; and an integrated analog multiplexor which is connected to the twin cell circuit.

A memory device includes a memory array and control logic, operatively coupled with the memory array, to perform operations including causing a first current to be obtained with respect to cells of a wordline maintained at a first voltage, determining that the cells are at a second voltage lower than the first voltage, in response to determining that the cells are the second voltage, causing a voltage ramp down process to be initiated, causing a second current to be sampled with respect to the cells during the voltage ramp down process, and detecting an existence of charge loss by determining whether the second current satisfies a threshold condition in view of the first current.

The present application provides a memory test circuit and a device wafer including the memory test circuit. The memory test circuit is coupled to a memory array having intersecting first and second signal lines, and includes a fuse element and a transistor. The fuse element has a first terminal coupled to a first group of the first signal lines and a test voltage, and has a second terminal coupled to second and third groups of the first signal lines. The transistor has a source/drain terminal coupled to the second terminal of the fuse element and another source/drain terminal coupled to a reference voltage. The first group of the first signal lines are selectively coupled to the test voltage when the transistor is turned on, and all of the first signal lines are coupled to the test voltage when the transistor is kept off.

Disclosed is an operation method of a memory device which includes floating a first driving line corresponding to a first word line from the first word line and precharging the first driving line with a first voltage, floating the first driving line from the first voltage to sense a first voltage variation of the first driving line, storing the first voltage variation in a first capacitor, electrically connecting the first driving line to the first word line and precharging the first driving line and the first word line with the first voltage, floating the first driving line and the first word line from the first voltage to sense a second voltage variation of the first driving line and the first word line, and outputting a first detection signal corresponding to a first leakage current through the first word line based on the first voltage variation and the second voltage variation.

In a method for accessing memory cells, a first read operation is performed on a first memory cell to read a first data value from the first memory cell. During the first read operation, a first variable current source provides a first assessment current having a first current level to a first bitline coupled to the first memory cell. A second read operation is performed on the first memory cell to read a second data value from the first memory cell. During the second read operation, the first variable current source manipulates the first current level to provide a second current level to the first bitline. A difference between the first current level and the second current level is based on whether the first data value that was read during the first read operation was a first data state or a second data state.

Disclosed herein is a semiconductor device including a non-volatile memory unit. The non-volatile memory unit has a subject current path disposed in a semiconductor integrated circuit and a fuse element inserted in series on the subject current path, and changes output data according to a voltage between both ends of the fuse element when supply of a subject current to the subject current path is intended. A current supply part that switches the subject current between a plurality of stages is disposed in the non-volatile memory unit.

The disclosure is directed to a memory device with a leakage current verifying circuit for minimizing leakage current. In an aspect, the memory device includes not limited to a memory array, a leakage current verifying circuit, and a controller. The controller is configured to perform an erase operation for a first column of memory cells connected to a first WL, set a verify condition including a leakage current threshold, perform a leakage current verifying operation for the first column of the memory cells by comparing a leakage current of a cell of the first column of the memory cells to the leakage current threshold, detect a failure of the first column in response to a cell having the leakage current being above the leakage current threshold, and perform a post-program operation to repair the failure of the first column of the memory cells.