A ferroelectric memory circuit (100) includes: a memory cell (102), wherein a memory state (102s) of the memory cell (102) is switchable between a first memory state and a second memory state, the memory cell (102) further configured to output an electrical current (101) in response to receiving a readout voltage (103); and a sense circuit (104) configured to output an output voltage (105) based on the result of integrating the electrical current (101) output by the memory cell (102), wherein the output voltage (105) represents whether the memory state (102s) is the first memory state or the second memory state.

An Input/Output (I/O) circuit for a memory device is provided. The I/O circuit includes a charge integration circuit coupled to a bitline of the memory device. The charge integration circuit provides a sensing voltage based on a decrease of a voltage on the bitline. A comparator is coupled to the charge integration circuit. The comparator compares the sensing voltage with a reference voltage and provides an output voltage based on the comparison. A time-to-digital converter coupled to the comparator. The time-to-digital convertor converts a time associated with the output voltage to a digital value.

A memory device includes a sense amplifier coupled to a first read voltage during a first phase of a read operation and a second read voltage during a second phase of the read operation. A first and second bias voltages are based on the first and second read voltages and corresponding current on a bit line. A first capacitor includes a terminal coupled to the first and second bias voltages. A first amplifier includes an input coupled to another terminal of the first capacitor and another input coupled to a common mode voltage during the first phase and to a reference voltage during the second phase. A second capacitor includes a terminal coupled to an output of the first amplifier. A second amplifier includes an inverting input coupled to another terminal of the second capacitor and another input coupled to a common mode voltage.

A circuit for reading a programmed resistive state of resistive elements of a resistive memory, wherein each resistive element may be programmed to be in a first or a second resistive state, wherein the circuit includes a current integrator suitable for integrating a difference in current between a reading current flowing through a first of the resistive elements and a reference current.

A counter can have a number of sensing components. Each respective sensing component can be configured to sense a respective event and can include a respective first capacitor configured to be selectively coupled to a second capacitor in response to the respective sensing component sensing the respective event. The second capacitor can be configured to be charged to a voltage by each respective first capacitor that is selectively coupled to the second capacitor. The counter can have a comparator with a first input coupled to the second capacitor and a second input coupled to a reference voltage corresponding to a threshold quantity of events. The comparator can be configured to output a signal indicative of the threshold quantity of events being sensed in response to the voltage of the second capacitor being greater than or equal to the reference voltage.

A state detection circuit of an anti-fuse memory cell includes a first switching element, having a first end connected to a power supply, a second end connected to a first node, and a control end connected to a controller; an anti-fuse memory cell array including a plurality of anti-fuse memory cell sub-arrays, bit lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the first node, and word lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the controller; and a comparator, having a first input end connected to the first node, and a second input end connected to a reference voltage.

Methods and devices for reading a memory cell using multi-stage memory sensing are described. The memory cell may be coupled to a digit line after the digit line during a read operation. A transistor may be activated to couple an amplifier capacitor with the digit line during the read operation. The transistor may be deactivated for a portion of the read operation to isolate the amplifier capacitor from the digit line while the memory cell is coupled to the digit line. The transistor may be reactivated to recouple the amplifier capacitor to the digit line to help determine the value of the memory cell.

Methods and devices for reading a memory cell using multi-stage memory sensing are described. The memory cell may be coupled to a digit line after the digit line during a read operation. A transistor may be activated to couple an amplifier capacitor with the digit line during the read operation. The transistor may be deactivated for a portion of the read operation to isolate the amplifier capacitor from the digit line while the memory cell is coupled to the digit line. The transistor may be reactivated to recouple the amplifier capacitor to the digit line to help determine the value of the memory cell.

A counter can have a number of sensing components. Each respective sensing component can be configured to sense a respective event and can include a respective first capacitor configured to be selectively coupled to a second capacitor in response to the respective sensing component sensing the respective event. The second capacitor can be configured to be charged to a voltage by each respective first capacitor that is selectively coupled to the second capacitor. The counter can have a comparator with a first input coupled to the second capacitor and a second input coupled to a reference voltage corresponding to a threshold quantity of events. The comparator can be configured to output a signal indicative of the threshold quantity of events being sensed in response to the voltage of the second capacitor being greater than or equal to the reference voltage.

Methods and devices for reading a memory cell using multi-stage memory sensing are described. The memory cell may be coupled to a digit line after the digit line during a read operation. A transistor may be activated to couple an amplifier capacitor with the digit line during the read operation. The transistor may be deactivated for a portion of the read operation to isolate the amplifier capacitor from the digit line while the memory cell is coupled to the digit line. The transistor may be reactivated to recouple the amplifier capacitor to the digit line to help determine the value of the memory cell.