An example apparatus can include a memory array and a memory controller. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The memory controller can be coupled to the first portion and the second portion. The memory controller can be configured to operate the first plurality of memory cells for short-term memory operations. The memory controller can be further configured to operate the second plurality of memory cells for long-term memory operations.

An example apparatus can include a memory array and a memory controller. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The memory controller can be coupled to the first portion and the second portion. The memory controller can be configured to operate the first plurality of memory cells for short-term memory operations. The memory controller can be further configured to operate the second plurality of memory cells for long-term memory operations.

The present disclosure includes apparatuses and methods for material implication operations in memory with reduced program voltages. An example apparatus can include an array of memory cells that further includes a first memory cell coupled to a first access line and to a first one of a plurality of second access lines and a second memory cell coupled to the first access line and to a second one of the plurality of second access lines. The circuitry can be configured to apply, across the second memory cell, a first voltage differential having a first polarity and a first magnitude. The first voltage differential reduces, if the second memory cell is programmed to a first data state, a magnitude of a drifted threshold voltage for programming the second memory cell to a second data state. The circuitry is further configured to apply, subsequent to the application of the first voltage differential, a first signal to the first access line. The circuitry is further configured to, while the first signal is being applied to the first access line, apply, subsequent to the application of the first voltage differential, a second voltage differential having a second polarity and the first magnitude across the first memory cell and apply a third voltage differential having the second polarity across the second memory cell. A material implication operation is performed as a result of the first, second, and third voltage differentials applied across the first and the second memory cells with a result of the material implication operation being stored on the second memory cell.

A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.

A lead-free metallic halide memristor is disclosed. The lead-free metallic halide memristor comprises a first electrode layer, an active layer and a second electrode layer, of which the active layer is made of a metallic halide material. Experimental data have proved that the lead-free metallic halide memristor possesses synaptic plasticity because of showing characteristics of short-term potentiation, short-term depression, long-term potentiation, long-term depression during the experiments. Therefore, the lead-free metallic halide memristor has significant potential for being used as an artificial synaptic element so as to be further applied in the manufacture of a reservoir computing chip. Moreover, experimental data have also proved that the lead-free metallic halide memristor also shows the characteristics of multi-level resistive switching, whereupon the lead-free metallic halide memristor can be further used as analog non-volatile memory so as to be further applied in the manufacture of a neuromorphic computing chip.

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

A low voltage forming NVM structure including a plurality of ReRAM devices arranged in a cross bar array and sandwiched between a plurality of first electrically conductive structures and a plurality of second electrically conductive structures. Each first electrically conductive structure is oriented perpendicular to each second electrically conductive structure. The plurality of second electrically conductive structures includes a first set of second electrically conductive structures having a first top trench area A1, and a second set of second electrically conductive structures having a second top trench area A2 that is greater than A1. Each second electrically conductive structure of the first set contacts a surface of at least one of the first electrically conductive structures, and each second electrically conductive structure of the second set contacts a top electrode of at least one of the ReRAM devices.

Methods, systems, and devices for mimicking neuro-biological architectures that may be present in a nervous system are described herein. A memory device may include a memory unit configured to store a value. A memory unit may include a first memory cell (e.g., an aggressor memory cell) and a plurality of other memory cells (e.g., victim memory cells). The memory unit may use thermal disturbances of the victim memory cells that may be based on an access operation to store the analog value. Thermal energy output by the aggressor memory cell during an access operation (e.g., a write operation) may cause the state of the victim memory cells to alter based on thermal relationship between the aggressor memory cell and at least some of the victim memory cells. The memory unit may be read by detecting and combining the weights of the victim memory cells during a read operation.

A semiconductor memory may include: variable resistance layers and insulating layers alternately stacked; conductive pillars passing through the variable resistance layers and the insulating layers; a slit insulating layer passing through the insulating layers and extending in a first direction; and conductive layers interposed between the slit insulating layer and the variable resistance layers. The variable resistance layers may remain in an amorphous state during a program operation.

A phase-change material having specific SiO.sub.x doping into special Ge-rich Ge.sub.xSb.sub.yTe.sub.z material is described. Integrated circuits using this phase-change material as memory elements in a memory array can pass the solder bonding criteria mentioned above, while exhibiting good set speeds and demonstrating good 10 year data retention characteristics. A memory cell described herein comprises a first electrode and a second electrode; and a memory element in electrical series between the first and second electrode. The memory element comprises a Ge.sub.xSb.sub.yTe.sub.z phase change material with a silicon oxide additive, including a combination of elements having Ge in a range of 28 to 36 at %, Sb in a range of 10 to 20 at %, Te in a range of 25 to 40 at %, Si in a range of 5 to 10 at %, and O in a range of 12 to 23 at %.