Numerous embodiments are disclosed for accessing redundant non-volatile memory cells in place of one or more rows or columns containing one or more faulty non-volatile memory cells during a program, erase, read, or neural read operation in an analog neural memory system used in a deep learning artificial neural network.

Numerous examples of summing circuits for a neural network are disclosed. In one example, a circuit for summing current received from a plurality of synapses in a neural network comprises a voltage source; a load coupled between the voltage source and an output node; a voltage clamp coupled to the output node for maintaining a voltage at the output node; and a plurality of synapses coupled between the output node and ground; wherein an output current flows through the output node, the output current equal to a sum of currents drawn by the plurality of synapses.

A method of programing a memory device having a plurality of memory cell groups where each of the memory cell group includes N non-volatile memory cells, where N is an integer greater than or equal to 2. For each memory cell group, the method includes programming each of the non-volatile memory cells in the memory cell group to a particular program state, performing multiple read operations on each of the non-volatile memory cells in the memory cell group, identifying one of the non-volatile memory cells in the memory cell group that exhibits a lowest read variance during the multiple read operations, deeply programming all of the non-volatile memory cells in the memory cell group except the identified non-volatile memory cell, and programming the identified non-volatile memory cell in the memory cell group with user data.

Numerous embodiments are disclosed for providing temperature compensation in an analog memory array. A method and related system are disclosed for compensating for temperature changes in an array of memory cells by measuring an operating temperature within the array of memory cells and changing a threshold voltage of a selected memory cell in the array of memory cells to compensate for a change in the operating temperature.

Numerous embodiments are disclosed of a non-volatile memory cell array formed in a p-well, which is formed in a deep n-well, which is formed in a p-substrate. During an erase operation, a negative voltage is applied to the p-well, which reduces the peak positive voltage required to be applied to the cells to cause the cells to erase.

Configurable input blocks and output blocks and physical layouts are disclosed for analog neural memory systems that utilize non-volatile memory cells. An input block can be configured to support different numbers of arrays arranged in a horizontal direction, and an output block can be configured to support different numbers of arrays arranged in a vertical direction. Adjustable components are disclosed for use in the configurable input blocks and output blocks.

The present invention relates to a flash memory device that uses strap cells in a memory array of non-volatile memory cells as source line pull down circuits. In one embodiment, the strap cells are erase gate strap cells. In another embodiment, the strap cells are source line strap cells. In another embodiment, the strap cells are control gate strap cells. In another embodiment, the strap cells are word line strap cells.

A non-volatile memory device is provided. The non-volatile memory device includes a substrate, a floating gate, and a gate. The substrate includes a source region and a drain region, and a channel region between the source region and the drain region. The floating gate is over the channel region. The floating gate includes a first conductive layer and a second conductive layer underlying the first conductive layer. The gate is adjacent to the floating gate.

An electrically erasable programmable nonvolatile memory cell includes a semiconductor substrate having a first substrate region and a trench region apart from the first substrate region in a lateral direction, a channel region between the first substrate region and the bottom portion of the trench region, an electrically conductive control gate insulated from and disposed over the first channel portion, an electrically conductive floating gate insulated from the bottom and sidewall portions of the trench region, an insulation region disposed over the second channel portion between the control gate and the second floating gate portion, an electrically conductive source line insulated from the floating gate and electrically connected to the trench region of the substrate, and an electrically conductive erase gate insulated from and disposed over a tip of the floating gate.

Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first terminal coupled to a substrate of the semiconductor structure, with the first terminal including a first portion of a tunneling layer formed on the substrate, and a first gate formed on the first portion of the tunneling layer. The semiconductor structure includes a second terminal coupled to the substrate and adjacent to the first terminal, with the second terminal including a second portion of the tunneling layer formed on the substrate, a second gate formed on the second portion of the tunneling layer, and a dielectric structure formed on a top surface and side surfaces of the second gate. The semiconductor structure includes a third terminal coupled to an insulating structure and adjacent to the second terminal, with the third terminal including, a third gate formed on the insulating structure.