A memory system includes a memory device and a controller. The controller is coupled to the memory device through input/output (I/O) lines. The controller includes an interface component and a dummy power consumption component. The interface component performs a signal training operation for adjusting a timing of a clock signal, to which test data is synchronized. The dummy power consumption component performs a dummy power consumption operation while the signal training operation is performed.

Technologies for performing a quick reliability scan include, for a particular block of a set of blocks of different block types. Each block of the set of blocks includes pages of memory of a physical memory device. A subset of the pages of the block is identified. The block is scanned by scanning the subset of the plurality of pages of the block for a fold condition. A page of the subset of the plurality of pages is determined to have the fold condition. After the set of blocks has been scanned, the folding of the block that includes the page that has been determined to have the fold condition is requested.

Methods and systems for testing memory systems are disclosed. A refresh rate for a test system including a number of memory devices may be controlled based on estimated power scenario of a memory system design. In response to performance of a number of refresh operations on the memory devices and based on the refresh rate, one or more conditions of the test system may be monitored to generate estimated performance data for the memory system design.

Embodiments presented herein are directed to testing and/or debugging a memory device of a memory module (e.g., a dual in-line memory module (DIMM)) without having to remove the DIMM from a corresponding computing device and without having to interrupt operation of the computing device. A particular memory device (e.g., DRAM) may be identified for testing and/or debugging based on a failure message. However, the failure message may not identify a specific location or hardware of the module that caused the failure. Embodiments presented herein provide techniques to obtain data for analysis to determine and/or deliver a cause of the failure while reducing or eliminating downtime of the computing device. Test modes to do so may include a synchronous test mode, an asynchronous test mode, and an analog compare mode. A test mode may be selected based on the failure or a signal/function of the DRAM to be tested or debugged.

A memory device to program a group of memory cells to store multiple bits per memory cell. Each bit per memory cell in the group from a page. After determining a plurality of read voltages of the group of memory cells, the memory device can read the multiple pages of the group using the plurality of read voltages. For each respective page in the multiple pages, the memory device can determine a count of first memory cells in the respective page that have threshold voltages higher than a highest read voltage, among the plurality of read voltages, used to read the respective page. The count of the first memory cells can be compared with a predetermined range of a fraction of memory cells in the respective page to evaluate the plurality of read voltages (e.g., whether any of the read voltages is in a wrong voltage range).

Systems and methods of screening memory cells by modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven as compared to a nominal operating voltage on the wordline. In a write operation, the one or both of the bitline and wordline may be overdriven or underdriven as compared to a nominal operating voltage of each. A built-in self test (BIST) system for screening a memory array has bitline and wordline margin controls to modulate bitline and wordline voltage, respectively, in the memory array.

A nonvolatile memory device includes a memory cell array, a voltage generator, a voltage path circuit and a wordline defect detection circuit. The memory cell array includes memory cells and wordlines connected to the memory cells. The voltage generator generates a wordline voltage applied to the wordlines. The voltage path circuit between the voltage generator and the memory cell array transfers the wordline voltage to the wordlines. The wordline defect detection circuit is connected to a measurement node between the voltage generator and the voltage path circuit. The wordline defect detection circuit measures a path leakage current of the voltage path circuit based on a measurement voltage of the measurement node to generate an offset value corresponding to the path leakage current in a compensation mode and determines defect of each wordline of the wordlines based on the offset value and the measurement voltage in a defect detection mode.

A memory device includes a memory array and control logic, operatively coupled with the memory array, to perform operations including causing a first current to be obtained with respect to cells of a wordline maintained at a first voltage, determining that the cells are at a second voltage lower than the first voltage, in response to determining that the cells are the second voltage, causing a voltage ramp down process to be initiated, causing a second current to be sampled with respect to the cells during the voltage ramp down process, and detecting an existence of charge loss by determining whether the second current satisfies a threshold condition in view of the first current.

An impedance calibration circuit, an impedance calibration method, and a memory are provided. The impedance calibration circuit includes a parameter module, an initial value generation module, and a calibration module. The parameter module is configured to perform environment detection processing and output an environment parameter signal; the initial value generation module is configured to receive the environment parameter signal, and output an initial calibration value based on the environment parameter signal when the calibration instruction signal is received; and the calibration module is configured to receive the initial calibration value, and perform impedance calibration processing based on the initial calibration value when the calibration instruction signal is received.

A receiver includes the following: a signal receiving circuit, including a first MOS transistor and a second MOS transistor, where a gate of the first MOS transistor is configured to receive a reference signal and a gate of the second MOS transistor is configured to receive a data signal, and the signal receiving circuit is configured to output a comparison signal, the comparison signal being configured to represent a magnitude relationship between a voltage value of the reference signal and a voltage value of the data signal; and an adjusting circuit, including a third MOS transistor, where a source of the third MOS transistor is connected to a source of the first MOS transistor, a drain of the third MOS transistor is connected to a drain of the first MOS transistor, and a gate of the third MOS transistor is configured to receive an adjusting signal.