Patent classifications
G11C29/18
Memory, memory system, operation method of the memory, and operation of the memory system
A method for operating a memory includes determining to perform an error correction operation; determining whether to perform an error correction operation; generating an internal address when the error correction operation is performed; reading data from memory cells that are selected based on the internal address and an error correction code corresponding to the data; performing an error correction operation on the data based on the error correction code to produce an error-corrected data; writing the error-corrected data and an error correction code corresponding to the error-corrected data into the memory cells; determining one or more regions among regions in the memory as a repair-requiring region based on an error detected when the error correction operation is performed; receiving a first command; backing up the data and the error correction code into a redundant region in response to the first command; and repairing the repair-requiring region with the redundant region.
Memory device and test circuit for the same
The present disclosure provides a memory device, wherein: an address latch can output a block selection control signal according to a block selection enable signal; a test mode selection unit can output a test mode selection signal according to a test mode selection instruction signal; a block selection unit outputs a block selection signal according to a mode selection signal and a block selection enable signal; when the memory enters a first test mode according to the test mode selection signal, an output buffer disables some of the input/output ports, and sequentially outputs the first input/output data and the second input/output data through un-disabled the input/output ports. The memory device according to the present disclosure can occupy less input/output ports of a test machine.
Screening of memory circuits
Systems and methods of screening memory cells by modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven as compared to a nominal operating voltage on the wordline. In a write operation, the one or both of the bitline and wordline may be overdriven or underdriven as compared to a nominal operating voltage of each. A built-in self test (BIST) system for screening a memory array has bitline and wordline margin controls to modulate bitline and wordline voltage, respectively, in the memory array.
Semiconductor device for detecting failure in address decoder
A semiconductor device includes a memory array arranged in a matrix, a plurality of word lines provided corresponding to memory cell rows, a word driver for driving one of the plurality of word lines, a plurality of row select lines connected to the word driver, and a row decoder for outputting a row select signal to the plurality of row select lines based on input row address information. According to the embodiment, the semiconductor device can detect a failure of the address decoder in a simple method.
TESTING SYSTEM AND TESTING METHOD
A testing system includes a plurality of memory circuits and a testing circuit. The testing circuit is coupled to the memory circuits. The testing circuit is configured to perform a read/write operation on the memory circuits, and each of the memory circuits has a read/write starting time point corresponding to the read/write operation. The testing circuit is further configured to control the read/write starting time points of the memory circuits to be different from each other.
TESTING SYSTEM AND TESTING METHOD
A testing system includes a plurality of memory circuits and a testing circuit. The testing circuit is coupled to the memory circuits. The testing circuit is configured to perform a read/write operation on the memory circuits, and each of the memory circuits has a read/write starting time point corresponding to the read/write operation. The testing circuit is further configured to control the read/write starting time points of the memory circuits to be different from each other.
SEMICONDUCTOR MEMORY DEVICE CAPABLE OF PERFORMING SOFT-POST-PACKAGE-REPAIR OPERATION
Disclosed herein is an apparatus that includes a fuse array circuit including a plurality of fuse sets each assigned to a corresponding one of a plurality of fuse addresses and configured to operatively store a fuse data, and a first circuit configured to generate and sequentially update a fuse address to sequentially read the fuse data from the plurality of fuse sets. The first circuit is configured to change a frequency of updating the fuse address based on a first signal.
SEMICONDUCTOR MEMORY DEVICE CAPABLE OF PERFORMING SOFT-POST-PACKAGE-REPAIR OPERATION
Disclosed herein is an apparatus that includes a fuse array circuit including a plurality of fuse sets each assigned to a corresponding one of a plurality of fuse addresses and configured to operatively store a fuse data, and a first circuit configured to generate and sequentially update a fuse address to sequentially read the fuse data from the plurality of fuse sets. The first circuit is configured to change a frequency of updating the fuse address based on a first signal.
Apparatuses and methods for self-test mode abort circuit
Apparatuses, systems, and methods for self-test mode abort circuit. Memory devices may enter a self-test mode and perform testing operations on the memory array. During the self-test mode, the memory device may ignore external communications. The memory includes an abort circuit which may terminate the self-test mode if it fails to properly finish. For example, the abort circuit may count an amount of time since the self-test mode began and end the self-test mode if that amount of time meets or exceeds a threshold, which may be based off of the expected amount of time for the testing operations to complete.
Apparatuses and methods for self-test mode abort circuit
Apparatuses, systems, and methods for self-test mode abort circuit. Memory devices may enter a self-test mode and perform testing operations on the memory array. During the self-test mode, the memory device may ignore external communications. The memory includes an abort circuit which may terminate the self-test mode if it fails to properly finish. For example, the abort circuit may count an amount of time since the self-test mode began and end the self-test mode if that amount of time meets or exceeds a threshold, which may be based off of the expected amount of time for the testing operations to complete.