A memory device can sense stored data during memory read operations using a reference trim, and a memory built-in self-test system can perform a multiple step process to set the reference trim for the memory device. The memory built-in self-test system can set a reference trim range that corresponds to a range of available reference trim values and then select one of the reference trim values in the reference trim range as the reference trim for the memory device. The memory built-in self-test system can set the reference trim range by prompting performance of the memory read operations using different positions of the reference trim range relative to read characteristics of the memory device and set a position for the reference trim range relative to the read characteristics of the memory device based on failures of the memory device to correctly sense the stored data during the memory read operations.

A memory device can sense stored data during memory read operations using a reference trim, and a memory built-in self-test system can perform a multiple step process to set the reference trim for the memory device. The memory built-in self-test system can set a reference trim range that corresponds to a range of available reference trim values and then select one of the reference trim values in the reference trim range as the reference trim for the memory device. The memory built-in self-test system can set the reference trim range by prompting performance of the memory read operations using different positions of the reference trim range relative to read characteristics of the memory device and set a position for the reference trim range relative to the read characteristics of the memory device based on failures of the memory device to correctly sense the stored data during the memory read operations.

Methods, systems, and devices for techniques for retiring blocks of a memory system are described. In some examples, aspects of a memory system or memory device may be configured to determine an error for a block of memory cells. Upon determining the occurrence of the error, the memory system may identify one or more operating conditions associated with the block. For example, the memory system may determine a temperature of the block, a cycle count of the block, a quantity of times the block has experienced an error, a bit error rate of the block, and/or a quantity of available blocks in the associated system. Depending on whether a criteria associated with a respective operating condition is satisfied, the block may be enabled or retired.

Embodiments of the disclosure are drawn to apparatuses, systems, and methods for direct access hybrid testing. A memory device, such as a high bandwidth memory (HBM) may include direct access terminals. During a testing procedure, test instructions may be provided to the memory through the direct access terminals. The test instructions include a data pointer which is associated with one of a plurality of test patterns pre-loaded in the memory and an address. The selected test pattern may be written to, and subsequently read from, the memory cells associated with the address. The read test pattern may be compared to the selected test pattern to generate result information. The test patterns may be loaded to the memory, and the result information may be read out from the memory, in an operational mode different than the operational mode in which the test instructions are provided.

Embodiments of the disclosure are drawn to apparatuses, systems, and methods for direct access hybrid testing. A memory device, such as a high bandwidth memory (HBM) may include direct access terminals. During a testing procedure, test instructions may be provided to the memory through the direct access terminals. The test instructions include a data pointer which is associated with one of a plurality of test patterns pre-loaded in the memory and an address. The selected test pattern may be written to, and subsequently read from, the memory cells associated with the address. The read test pattern may be compared to the selected test pattern to generate result information. The test patterns may be loaded to the memory, and the result information may be read out from the memory, in an operational mode different than the operational mode in which the test instructions are provided.

A controller including a non-volatile memory interface circuit connected to at least one non-volatile memory device and configured to control the at least one non-volatile memory device; an error correction circuit configured to perform an error correction operation on a codeword received from the non-volatile memory interface circuit according to an error correction decoding level from among a plurality of error correction decoding levels, wherein the non-volatile memory interface circuit is further configured to: receive side information from the at least one non-volatile memory device; predict a distribution of memory cells based on the side information; and select the error correction decoding level from among the plurality of error correction decoding levels according to the predicted distribution.

A storage device includes 3D NAND including layers of multi-level cells. Test reads are performed by reading only LSB pages and reading layers in a repeating pattern of reading two and skipping two. A test read of a block is performed when its read count reaches a threshold. The counter threshold is updated according to errors detected during the test read such that the frequency of test reads increases with increase in errors detected. Counter thresholds according to errors may be specified in a table. The table may be selected as corresponding to a range of PEC values including the current PEC count of the 3D NAND. Each table further specifies a number of errors that will result in garbage collection being performed.

A memory device includes a system block for storing test information and includes a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines. The memory device also includes a column repair controller configured to detect, based on the test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

A memory device includes a system block for storing test information and includes a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines. The memory device also includes a column repair controller configured to detect, based on the test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

A storage system has a memory with a multi-level cell (MLC) block and a partially-bad single-level cell (SLC) block. The storage system repurposes the partially-bad SLC block as a non-volatile read cache for data stored in the MLC block (e.g., cold data that is read relatively frequently) to improve performance of host reads. Because the original version of the data is still stored in the MLC block, the original version of the data can be read if there is an error in the copy of the data stored in the partially-bad SLC block, thus avoiding the need for extensive error-correction handling to account for the poor reliability of the partially-bad SLC block.