Patent classifications
G11C29/842
Write and read common leveling for 4-bit wide drams
Systems and methods of write deskew training for ×4 mode memory control interface configurations. Write leveling logic in the memory controller is adjusted to obtain a write leveling setting for delaying both first and second strobe signals associated with a byte. The adjustment is based on feedback of first set of bits of a byte and irrespective of the feedback of the second set of bits of the byte. The write leveling logic is then anchored at the write leveling setting, and a deskew delay line for the second strobe signal is adjusted to obtain a first deskew setting based on the feedback of the second set of bits. Thus, in write operations, the write leveling setting can be common within the byte even the two strobe signals are transmitted to or received from two different memory storage devices.
SEMICONDUCTOR DEVICE WITH WORD LINE DEGRADATION MONITOR AND ASSOCIATED METHODS AND SYSTEMS
Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to monitor degradations in word line characteristics. The memory device may generate a reference signal in response to an access command directed to a memory array including a plurality of word lines, in some embodiments. The memory array may include a victim word line configured to accumulate adverse effects of executing multiple access commands at the word lines of the memory array. When the degradation in the word line characteristics causes reliability issues (e.g., corrupted data), the memory array is deemed unreliable, and may be blocked from memory operations. The memory device may compare the reference signal and a signal from the victim word line to determine whether preventive measures may be appropriate to avoid (or mitigate) such reliability issues.
Semiconductor device with word line degradation monitor and associated methods and systems
Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to monitor degradations in word line characteristics. The memory device may generate a reference signal in response to an access command directed to a memory array including a plurality of word lines, in some embodiments. The memory array may include a victim word line configured to accumulate adverse effects of executing multiple access commands at the word lines of the memory array. When the degradation in the word line characteristics causes reliability issues (e.g., corrupted data), the memory array is deemed unreliable, and may be blocked from memory operations. The memory device may compare the reference signal and a signal from the victim word line to determine whether preventive measures may be appropriate to avoid (or mitigate) such reliability issues.
MEMORY SYSTEM WITH REDUNDANT OPERATION
A memory system includes a memory that provides digital data and a built-in self-test (BIST) circuit for testing the memory for determining defective storage units of the memory. The memory system has a data output for providing data from the memory to an external system. The data output of the memory system has a first bit width. The memory has a data output that has a second bit width that is greater than the first bit width. The BIST circuit has a data input that is of the second bit width.
Semiconductor device with word line degradation monitor and associated methods and systems
Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to monitor degradations in word line characteristics. The memory device may generate a reference signal in response to an access command directed to a memory array including a plurality of word lines, in some embodiments. The memory array may include a victim word line configured to accumulate adverse effects of executing multiple access commands at the word lines of the memory array. When the degradation in the word line characteristics causes reliability issues (e.g., corrupted data), the memory array is deemed unreliable, and may be blocked from memory operations. The memory device may compare the reference signal and a signal from the victim word line to determine whether preventive measures may be appropriate to avoid (or mitigate) such reliability issues.
SEMICONDUCTOR DEVICE WITH WORD LINE DEGRADATION MONITOR AND ASSOCIATED METHODS AND SYSTEMS
Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to monitor degradations in word line characteristics. The memory device may generate a reference signal in response to an access command directed to a memory array including a plurality of word lines, in some embodiments. The memory array may include a victim word line configured to accumulate adverse effects of executing multiple access commands at the word lines of the memory array. When the degradation in the word line characteristics causes reliability issues (e.g., corrupted data), the memory array is deemed unreliable, and may be blocked from memory operations. The memory device may compare the reference signal and a signal from the victim word line to determine whether preventive measures may be appropriate to avoid (or mitigate) such reliability issues.
Memory device
A memory device includes a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines; a decoder circuit including a first bias circuit inputting a first bias voltage to a selected word line, and a second bias circuit inputting a second bias voltage to a selected bit line, a first switch element connected to the selected word line, and a second switch element connected between the first switch element and the first bias circuit; and a control logic configured to control the first and second switch elements, when a predetermined delay time elapses after the second bias voltage is input to the selected bit line. The control logic turns off the first switch element while the second switch element is turned on.
Write and read common leveling for 4-bit wide DRAMS
System and method of write deskew training for 4 mode memory control interface configurations. Write leveling logic in the memory controller is adjusted to obtain a write leveling setting for delaying both first and second strobe signals associated with a byte. The adjustment is based on feedback of first set of bits of a byte and irrespective of the feedback of the second set of bits of the byte. The write leveling logic is then anchored at the write leveling setting, and a deskew delay line for the second strobe signal is adjusted to obtain a first deskew setting based on the feedback of the second set of bits. Thus, in write operations, the write leveling setting can be common within the byte even the two strobe signals are transmitted to or received from two different memory storage devices.
MEMORY DEVICE
A memory device includes a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines; a decoder circuit including a first bias circuit inputting a first bias voltage to a selected word line, and a second bias circuit inputting a second bias voltage to a selected bit line, a first switch element connected to the selected word line, and a second switch element connected between the first switch element and the first bias circuit; and a control logic configured to control the first and second switch elements, when a predetermined delay time elapses after the second bias voltage is input to the selected bit line. The control logic turns off the first switch element while the second switch element is turned on.
Fail redundancy circuits
A redundancy circuit includes a selection control signal generation circuit and a column control circuit. The selection control signal generation circuit drives an internal node, which is initialized, to generate a selection control signal when a logic level of a latched address signal is different from a logic level of a fuse signal. The column control circuit buffers a pre-column selection signal based on the selection control signal to generate a column selection signal for execution of a column operation of cells or to generate a redundancy column selection signal for execution of the column operation of redundancy cells.