A determination is made by a processing device included in a memory component that an operation to program data to a location in the memory component has failed, the data is programmed to a different location in the memory component by the processing device upon determining the operation has failed, and a notification that the data has been programmed to the different location in the memory component is provided by the processing device to a processing device operatively coupled to the memory component.

A memory is provided in which a scan chain covers the redundancy logic for column redundancy as well as the redundancy multiplexers in each column. The redundancy logic includes a plurality of redundancy logic circuits arranged in series. Each redundancy logic circuit corresponds to a respective column in the memory. Each column is configured to route a shift-in signal through its redundancy multiplexers during a scan mode of operation.

In certain aspects, a memory device includes an array of memory cells, an input/output (I/O) circuit, and control logic coupled to the I/O circuit. The array of memory cells includes a plurality of banks including a plurality of main banks and a redundant bank. The I/O circuit is coupled to each pair of adjacent banks of the plurality of banks and configured to direct a piece of data to or from either bank of each pair of adjacent banks. The control circuit is configured to select one bank of each pair of adjacent banks based on bank fail information indicative of a failed main bank of the plurality of main banks. The control circuit is further configured to control the I/O circuit to direct the piece of data to or from the selected bank of each pair of adjacent banks.

In certain aspects, a memory device includes an array of memory cells, an input/output (I/O) circuit, and I/O control logic coupled to the I/O circuit. The array of memory cells includes P groups of banks. P redundant banks are included in and shared by the P groups of banks. The I/O circuit is coupled to the P groups of banks and configured to direct P×N pieces of data to or from P×N working banks, respectively. The I/O control logic is configured to determine the P×N working banks from the P groups of banks based on bank fail information indicative of K failed main banks from the P groups of banks. The P×N working banks include K redundant banks of the P redundant banks. The I/O control logic is also configured to control the I/O circuit to direct P×N pieces of data to or from the P×N working banks, respectively.

A determination is made by a processing device included in a memory component that an operation to program data to a location in the memory component has failed, the data is programmed to a different location in the memory component by the processing device upon determining the operation has failed, and a notification that the data has been programmed to the different location in the memory component is provided by the processing device to a processing device operatively coupled to the memory component.

A self-repair memory circuit includes a cell array, a controller, a row repair decoder, and a column repair decoder. The cell array includes rows and columns of memory cells. The controller receives an input indicating row repair or column repair, and a repair address shared by the row repair and the column repair of the cell array. The row repair decoder maps the repair address of a defective row to a redundant row of the cell array when the input indicates the row repair. The column repair decoder maps the repair address of a defective column to another column of the cell array when the input indicates the column repair.

A read path for a memory is provided that includes an integrated sense mixing and redundancy shift stage coupled between a sense amplifier and a data latch. The data latch is integrated with a level shifter.

A device architecture includes a spatially reconfigurable array of processors, such as configurable units of a CGRA, having spare elements, and a parameter store on the device which stores parameters that tag one or more elements as unusable. Technologies are described which change the pattern of placement of configuration data, in dependence on the tagged elements. As a result, a spatially reconfigurable array having unusable elements can be repaired.

A memory device includes an at least one first normal mat and an at least one second normal mat, a first redundancy mat configured to provide one or more first redundancy column lines for repairing one or more column lines disposed in the at least one first normal mat, a second redundancy mat configured to provide one or more second redundancy column lines for repairing one or more column lines disposed in the at least one second normal mat, and a redundancy segmented input/output (I/O) line coupled to both of the first redundancy mat and the second redundancy mat.

A memory device includes an at least one first normal mat and an at least one second normal mat, a first redundancy mat configured to provide one or more first redundancy column lines for repairing one or more column lines disposed in the at least one first normal mat, a second redundancy mat configured to provide one or more second redundancy column lines for repairing one or more column lines disposed in the at least one second normal mat, and a redundancy segmented input/output (I/O) line coupled to both of the first redundancy mat and the second redundancy mat.