A microelectronic device comprises a base structure, a memory array overlying the base structure, and a conductive pad tier overlying the memory array. The base structure comprises a logic region including logic devices. The memory array comprises vertically extending strings of memory cells within a horizontal area of the logic region of the base structure. The conductive pad tier comprises first conductive pads substantially outside of the horizontal area of the logic region of the base structure, and second conductive pads horizontally neighboring the first conductive pads and within the horizontal area of the logic region of the base structure. Memory devices and electronic systems are also described.

Memory array structures providing for determination of resistive characteristics of access lines might include a first block of memory cells, a second block of memory cells, a first current path between a particular access line of the first block of memory cells and a particular access line of the second block of memory cells, and, optionally, a second current path between the particular access line of the second block of memory cells and a different access line of the first block of memory cells. Methods for determining resistive characteristics of access lines might include connecting the particular access line of the first block of memory cells to a driver, and determining the resistive characteristics in response to a current level through that access line and a voltage level of that access line.

A computing system for supporting a plurality of different types of memory devices includes a memory voltage regulator. The memory voltage regulator adjusts a supply voltage to a requisite voltage for a detected memory device based on serial presence detect (SPD) data. The computing system further includes a memory controller that supports a plurality of types of memory devices. The memory controller receives data regarding the type of the detected memory device, and controls input/output signals relative to the type of the detected memory device based on the SPD data and the GPIO data of the detected memory device.

A semiconductor memory device with a three-dimensional (3D) structure may include: a cell region arranged over a substrate, including a cell structure; a peripheral circuit region arranged between the substrate and the cell region; an upper wiring structure arranged over the cell region; main channel films and dummy channel films formed through the cell structure. The dummy channel films are suitable for electrically coupling the upper wiring structure.

Methods, apparatus, systems and articles of manufacture are disclosed facilitate read-modify-write support in a coherent victim cache with parallel data paths. An example apparatus includes a random-access memory configured to be coupled to a central processing unit via a first interface and a second interface, the random-access memory configured to obtain a read request indicating a first address to read via a snoop interface, an address encoder coupled to the random-access memory, the address encoder to, when the random-access memory indicates a hit of the read request, generate a second address corresponding to a victim cache based on the first address, and a multiplexer coupled to the victim cache to transmit a response including data obtained from the second address of the victim cache.

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes: line type bits configured to store an indication that a corresponding cache line of the second sub-cache is configured to store write-miss data, and an eviction controller configured to evict a cache line of the second sub-cache storing write-miss data based on an indication that the cache line has been fully written.

An integrated circuit (IC) includes first and scan latches that are enabled to load data during a first part of a clock period. A clocking circuit outputs latch clocks with one latch clock driven to an active state during a second part of the clock period dependent on a first address input. A set of storage elements have inputs coupled to the output of the first scan latch and are respectively coupled to a latch clock to load data during a time that their respective latch clock is in an active state. A selector circuit is coupled to outputs of the first set of storage elements and outputs a value from one output based on a second address input. The second scan latch then loads data from the selector's output during the first part of the input clock period.

A method can include, in an integrated circuit device: at a unidirectional command-address (CA) bus having no more than four parallel inputs, receiving a sequence of no less than three command value portions; latching each command value portion in synchronism with rising edges of a timing clock; determining an input command from the sequence of no less than three command value portions; executing the input command in the integrated circuit device; and on a bi-directional data bus having no more than six data input/outputs (IOs), outputting and inputting sequences of data values in synchronism with rising and falling edges of the timing clock. Corresponding devices and systems are also disclosed.

Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

A memory controller configured to control a non-volatile memory device includes: a signal generator configured to generate a plurality of control signals comprising a first signal and a second control signal; a core configured to provide a command for an operation of the non-volatile device; and a controller interface circuit configured to interface with the non-volatile memory device, wherein the controller interface circuit comprises a first transmitter connected to a first signal line and a second signal line; and a first receiver connected to the first signal line, and the first control signal and the second control signal are respectively transmitted to the non-volatile memory device through the first signal line and the second signal line.