Patent classifications
G12B9/02
INSTRUMENT ENCLOSURE
An instrument enclosure includes top and bottom sections, the bottom section having a first part fastened to a second part, and hinges hinging the top and bottom sections to enable the top section to rotate between a close positioned and an open position. When closed, the instrument enclosure defines an enclosed space suitable for receiving a field instrument. The bottom section may be fastened to a standpipe or to a bracket fastened to the standpipe. The bottom section may define an opening configured to receive the standpipe and/or an opening to receive process line tubing carrying process line signals to the field instrument. The field instrument may be affixed to an end portion of the standpipe received in the enclosed space, removably attached to an interior of the instrument enclosure, or affixed to a mounting plate attached to the standing pipe.
Receiving Device and Method for Production
A receiving device for a system for inductive power transmission has a housing with a cover part and a base part as housing parts. The housing has an internal volume for receiving at least one winding structure. One of the housing parts has at least one rib and the other housing part has at least one groove for receiving the at least one rib. The at least one rib and the at least one groove are arranged between the internal volume and an external volume. The receiving device has at least one sealing element. At least one portion of the at least one rib and at least one portion of the at least one sealing element are arranged in at least one portion of the at least one groove. A method for producing the receiving device is also disclosed.
Receiving Device and Method for Production
A receiving device for a system for inductive power transmission has a housing with a cover part and a base part as housing parts. The housing has an internal volume for receiving at least one winding structure. One of the housing parts has at least one rib and the other housing part has at least one groove for receiving the at least one rib. The at least one rib and the at least one groove are arranged between the internal volume and an external volume. The receiving device has at least one sealing element. At least one portion of the at least one rib and at least one portion of the at least one sealing element are arranged in at least one portion of the at least one groove. A method for producing the receiving device is also disclosed.
VANDAL-PROOF INSTALLATION SYSTEM FOR THE MONITORING OF PHYSICAL VARIABLES IN WATER, COMPRISING: A FIRST MEMBER; A SECOND MEMBER; A THIRD MEMBER AND A FOURTH MEMBER; WHERE THE FIRST MEMBER COMPRISES A PLURALITY OF COMPARTMENTS FOR HOUSING A PLURALITY OF DEVICES. ASSEMBLY METHOD
An anti-vandalism mounting system for monitoring water physical variables in open channels, which comprises: a first member, comprising a base with a plurality of perforations to introduce a plurality of anchoring means for fixing the first member to a system installation surface; a second member, which is fixed on the first member of the system by a plurality of anchoring means; a third member, arranged externally, which is attached to the first and second members from inside the system by anchoring means; and a fourth member, pivotally arranged in the lower part of the third member; wherein the first member comprises a plurality of compartments to house a plurality of devices for the operation of the system and for the monitoring of physical variables to be protected by the system; and wherein the system comprises an energy generating device and a plurality of safety devices, so that the fourth member is fixed to the third member of the system. A procedure for assembling an anti-vandalism mounting system for monitoring water physical variables in open channels.
Wafer type sensor, wafer alignment method using the same, and calibration device for calibrating wafer type sensor
A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.