A manufacturing process for a structure having a porcelain body and a flange includes: inserting an end portion of the body into a flange opening, providing a gap between the body end portion and a metal surface of the flange, filling the gap with adhesive to create a bond between the surfaces, installing an electrically active subassembly in the porcelain body and placing the structure in a heated environment to simultaneously dry the subassembly and fully cure the adhesive to provide the bond.

A manufacturing process for a structure having a porcelain body and a flange includes: inserting an end portion of the body into a flange opening, providing a gap between the body end portion and a metal surface of the flange, filling the gap with adhesive to create a bond between the surfaces, installing an electrically active subassembly in the porcelain body and placing the structure in a heated environment to simultaneously dry the subassembly and fully cure the adhesive to provide the bond.

The invention relates to an electrically insulating composite material (1) comprising a polyepoxide matrix (2) of cycloaliphatic type or of diglycidyl ether type in a content of less than 40% by mass, from 20 to 75% by mass of one or several micrometric and/or mesometric filler(s) (3), and from 0.1 to 20% by mass of at least one ionic liquid (4), the masses being expressed relative to the total mass of the electrically insulating composite material (1). The invention also relates to a method for manufacturing such an electrically insulating composite material (1), as well as its use for an electrically insulating support (9) in a metal-enclosed substation (5).

The invention relates to an electrically insulating composite material (1) comprising a polyepoxide matrix (2) of cycloaliphatic type or of diglycidyl ether type in a content of less than 40% by mass, from 20 to 75% by mass of one or several micrometric and/or mesometric filler(s) (3), and from 0.1 to 20% by mass of at least one ionic liquid (4), the masses being expressed relative to the total mass of the electrically insulating composite material (1). The invention also relates to a method for manufacturing such an electrically insulating composite material (1), as well as its use for an electrically insulating support (9) in a metal-enclosed substation (5).

A latent curable, single component, epoxy resin with a viscosity at 25° C. of between 50 and 100 poise may include, by weight: i) 60-90% of epichlorohydrin and bisphenol F; ii) 10-40% of epichlorohydrin and bisphenol A; and iii) 2-10% of a reactive catalyst, which is an encapsulated aliphatic polyamine, which cures above 80° C.

A latent curable, single component, epoxy resin with a viscosity at 25° C. of between 50 and 100 poise may include, by weight: i) 60-90% of epichlorohydrin and bisphenol F; ii) 10-40% of epichlorohydrin and bisphenol A; and iii) 2-10% of a reactive catalyst, which is an encapsulated aliphatic polyamine, which cures above 80° C.

A method of manufacturing a cable includes at least one elongated electrically conducting element and at least one composite layer surrounding the elongated electrically conducting element. The composite layer is obtained from at least one step of impregnation of a non-woven fibrous material with a geopolymer composition.

A method of manufacturing a cable includes at least one elongated electrically conducting element and at least one composite layer surrounding the elongated electrically conducting element. The composite layer is obtained from at least one step of impregnation of a non-woven fibrous material with a geopolymer composition.

Resin-rich mica tapes comprising one or more than one layer of mica paper and one or more than one layer of a nonmetallic inorganic fabric, in particular a glass fabric, which are pre-impregnated with an impregnation resin composition comprising an epoxy resin with more than one epoxy group, which is solid or semisolid at ambient temperature, a latent curing agent for said epoxy resin, about 5 to about 20% by weight of hexagonal boron nitride of a particle size (D50) of equal or less than about 3 μm, about 0.05 to about 1% by weight of a wetting agent and a suitable solvent which is removed after pre-impregnation of the mica tape with the impregnation resin mixture are useful to prepare electrical insulations with excellent thermal conductivity and dielectric dissipation factor.

The present invention discloses a preparation method of an insulating dielectric for improving energy density, including dissolving 1,4-phenylene diisothiocyanate in a polar solvent, then adding an organic diamine, and reacting at room temperature for 3 h to 6 h under a nitrogen atmosphere; then adding 4,4′-oxydianiline and pyromellitic dianhydride, and reacting at room temperature for 12 h to 18 h under a nitrogen atmosphere to obtain a random copolymer solution of polythiourea and polyamic acid; and spreading the random copolymer solution of polythiourea and polyamic acid on a copper plate, and carrying out gradient temperature elevation to obtain a random copolymer of polythiourea and polyimide.