A method for rejuvenating a strand-blocked cable having a conductor comprised of a plurality of conductor strands with interstitial volume therebetween blocked by a PIB based strand-block mastic, the conductor being surrounded by a polymeric cable insulation. The method including pre-injection of compressed gas into the conductor strands of the cable at a pressure less than the elastic limit of the cable insulation, and injection of a rejuvenation fluid into the conductor strands of the cable at a pressure less than the elastic limit of the cable insulation.

A method for rejuvenating a strand-blocked cable having a conductor comprised of a plurality of conductor strands with interstitial volume therebetween blocked by a PIB based strand-block mastic, the conductor being surrounded by a polymeric cable insulation. The method including pre-injection of compressed gas into the conductor strands of the cable at a pressure less than the elastic limit of the cable insulation, and injection of a rejuvenation fluid into the conductor strands of the cable at a pressure less than the elastic limit of the cable insulation.

This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.

This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.

The present disclosure relates to a high-voltage (HV) bushing comprising a condenser core configured for surrounding a HV electrical conductor. The condenser core comprises an insulation material comprising wound layers of a permeable solid material impregnated with a thermo-reversible gel. The gel comprises an oil and a thickener, the oil comprising iso-paraffinic oil in an amount within the range of 0.1-100 wt % of the oil and the thickener comprising at least one copolymer in an amount within the range of 0.1-10 wt % of the gel.

The present disclosure relates to a high-voltage (HV) bushing comprising a condenser core configured for surrounding a HV electrical conductor. The condenser core comprises an insulation material comprising wound layers of a permeable solid material impregnated with a thermo-reversible gel. The gel comprises an oil and a thickener, the oil comprising iso-paraffinic oil in an amount within the range of 0.1-100 wt % of the oil and the thickener comprising at least one copolymer in an amount within the range of 0.1-10 wt % of the gel.

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.

A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.