Patent classifications
H01B3/04
Papers comprising aerogel powder and aramid polymer fibrils
A paper suitable for use in a battery or battery pack as a flame barrier or thermal insulation, the paper comprising 60 to 95 weight percent aerogel powder and 5 to 40 weight aramid polymer fibrils; the paper having a thickness of 50 to 4000 micrometers.
Winding insulation system
A winding insulation system includes a set of insulated conductors, main wall insulation provided around the conductors, corona shield tape provided around the main wall insulation, stress grading tape provided around the corona shield tape, and sealing tape provided around the stress grading tape. The main wall insulation includes inner, intermediate, and outer sections. The inner section includes polyimide mica paper reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the inner section being provided in half-lap layer(s). The intermediate section includes mica paper reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the intermediate section being provided in half-lap layer(s). The outer section includes mica tape backed with aramid and reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the outer section being provided in half-lap layer(s).
Cable with semiconductive layer made of polypropylene composition and improved long term thermal stability
Described herein is a cable that includes a conductor surrounded by at least one semiconductive layer, wherein the layer comprises a polymer composition comprising a polypropylene homopolymer or a polypropylene copolymer with one or more comonomers, a polyolefin functionalized with an anhydride of a mono- or polycarboxylic acid, wherein said anhydride of a mono- or polycarboxylic acid can be linear or cyclic, wherein the functionalized polyolefin is different from the polypropylene homopolymer or polypropylene copolymer or the second polymer, and wherein the amount of the functionalized polyolefin is up to 10 wt % based on the total amount of the polymer composition, a solid conductive filler and a LDPE homopolymer or a LDPE copolymer of ethylene with one or more comonomers having a melting temperature (Tm) less than the Tm of the polypropylene homopolymer or polypropylene copolymer. Also described herein is a process for producing the polymer composition.
Cable with semiconductive layer made of polypropylene composition and improved long term thermal stability
Described herein is a cable that includes a conductor surrounded by at least one semiconductive layer, wherein the layer comprises a polymer composition comprising a polypropylene homopolymer or a polypropylene copolymer with one or more comonomers, a polyolefin functionalized with an anhydride of a mono- or polycarboxylic acid, wherein said anhydride of a mono- or polycarboxylic acid can be linear or cyclic, wherein the functionalized polyolefin is different from the polypropylene homopolymer or polypropylene copolymer or the second polymer, and wherein the amount of the functionalized polyolefin is up to 10 wt % based on the total amount of the polymer composition, a solid conductive filler and a LDPE homopolymer or a LDPE copolymer of ethylene with one or more comonomers having a melting temperature (Tm) less than the Tm of the polypropylene homopolymer or polypropylene copolymer. Also described herein is a process for producing the polymer composition.
High limiting oxygen index electrical insulation laminates
Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece.
High limiting oxygen index electrical insulation laminates
Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece.
SOLID PLATELETS USED AS FILLER IN A UV CURABLE THERMOSET RESIN TO ENHANCE THE ELECTRICAL INSULATION OF HIGH VOLTAGE CONDUCTOR BARS
An electrical insulation mixture for forming a layer on a conductor surface is provided. The mixture includes an UV curable thermoset resin and a filler. The filler includes UV transparent platelets made of a platelet material. UV transparency is given for light in a wavelength range between 300 and 420 nm. Furthermore, a method for electrically insulating a metallic conductor is provided. The method includes obtaining the electrical insulation mixture, forming a jacketing on a surface of the metallic conductor using the mixture thus obtained, and exposing the mixture to ultraviolet radiation to cure the mixture, thus forming, from the jacketing, an electrical insulation layer on the surface of the metallic conductor. A metallic conductor with an electrical insulation layer can be obtained by using the electrical insulation mixture.
SOLID PLATELETS USED AS FILLER IN A UV CURABLE THERMOSET RESIN TO ENHANCE THE ELECTRICAL INSULATION OF HIGH VOLTAGE CONDUCTOR BARS
An electrical insulation mixture for forming a layer on a conductor surface is provided. The mixture includes an UV curable thermoset resin and a filler. The filler includes UV transparent platelets made of a platelet material. UV transparency is given for light in a wavelength range between 300 and 420 nm. Furthermore, a method for electrically insulating a metallic conductor is provided. The method includes obtaining the electrical insulation mixture, forming a jacketing on a surface of the metallic conductor using the mixture thus obtained, and exposing the mixture to ultraviolet radiation to cure the mixture, thus forming, from the jacketing, an electrical insulation layer on the surface of the metallic conductor. A metallic conductor with an electrical insulation layer can be obtained by using the electrical insulation mixture.
Corona Shielding System For An Electrical Machine
The present disclosure relates to electrical machines. The teachings thereof may be embodied in a corona shielding system, especially an outer corona shielding system, for an electrical machine. For example, a corona shielding system may include: a polymeric matrix; particles disposed in the matrix, including a mica-coated core and a layer of metal oxide disposed on the core; and a surface functionalization material disposed on a surface of the particles for binding to the matrix.
Corona Shielding System For An Electrical Machine
The present disclosure relates to electrical machines. The teachings thereof may be embodied in a corona shielding system, especially an outer corona shielding system, for an electrical machine. For example, a corona shielding system may include: a polymeric matrix; particles disposed in the matrix, including a mica-coated core and a layer of metal oxide disposed on the core; and a surface functionalization material disposed on a surface of the particles for binding to the matrix.