A method of manufacturing an electrically insulated conductor for a battery system includes: covering a circumference of an electrical conductor with at least one fiber mat electrically insulating cover portion; and welding end portions of the fiber mat electrically insulating cover portion to form a closed insulating sleeve around the circumference of the electrical conductor.

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.

A flame resistant electrical insulating material comprises glass fibers, a particulate filler mixture, and an inorganic binder, wherein the electrical insulating material has a UL-94 flammability rating of V-0, 5VA and a thermal conductivity of less than 0.15 W/m-K. The particulate filler mixture comprises at least two particulate filler materials selected from the list of glass bubbles, kaolin clay, talc, mica, calcium carbonate, and alumina trihydrate. In an exemplary aspect, the insulating material is not punctured after direct exposure to 2054° C. (3730° F.) flame for at least 10 minutes.

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. after application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

A silica nanofiber material includes a flexible mat comprising a plurality of silica nanofibers. An electrical device may include an electrical component and the silica nanofiber material disposed over the electrical component. A method of forming a silica nanofiber material includes electrospinning a fluid comprising a silica precursor and a polymer to form electrospun fibers, removing at least a portion of the polymer from the electrospun fibers to form silica nanofibers, and annealing the silica nanofibers to bind the silica nanofibers together.

An electrical insulating system and an associated insulated stator bar are provided. The electrical insulating system includes an electrically insulating mica paper and a fiber glass disposed on a first surface of the electrically insulating mica paper. The electrically insulating mica paper and the fiber glass are impregnated with a curable binder resin composition. The curable binder resin composition includes about 21 weight percent to about 73 weight percent of a solid or semi-solid epoxy resin having an epoxide functionality of about 2.5, about 0.8 weight percent to about 49 weight percent of a liquid epoxy resin having an epoxide functionality of about 2, about 4 weight percent to about 15 weight percent of a bisphenol A-formaldehyde novolac, a metal acetylacetonate catalyst, and about 2.5 weight percent to about 15 weight percent of a toughener selected from the group consisting of polyethersulfone, methylmethacrylate butadiene styrene, and a combination thereof.

Electronic device comprising an at least partially electrically insulating carrier structure, which comprises a resin matrix and reinforcement structures in the resin matrix, wherein the reinforcement structures are provided at least partially with a thermal conductivity increasing coating, and an electrically conducting structure at and/or in the carrier structure, wherein at least in an interconnecting section between the carrier structure and the electrically conducting structure, the carrier structure is free from reinforcement structures provided with the coating, such that the electrically conducting structure and the coating are arranged non-contactingly relative to each other.