An insulation useful in the field of building materials, refrigeration, cryogenics, and shipping. The insulation has reduced radiative heat transfer by applying coating to the insulation material in order to alter the emissivity, including the infrared electromagnetic spectrum.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.

Described herein are materials and methods useful in the field of insulation, including building materials, refrigeration, cryogenics, and shipping, amongst others. Advantageously, the provided materials and method provide reduced radiative heat transfer by applying coatings to insulating materials in order to alter the emissivity, including in the infrared electromagnetic spectrum. Advantageously, the provided materials and methods, while increasing thermal conductivity, provide an overall reduction in heat transfer and therefore provide superior insulation.

Described herein are materials and methods useful in the field of insulation, including building materials, refrigeration, cryogenics, and shipping, amongst others. Advantageously, the provided materials and method provide low thermal conductivities and increased mechanical strength, allowing for efficient insulating in a diverse range of applications. The provided materials and methods include individual particles connected by a polymer network that links individual particles and may include hollow or evacuated capsules and various strengthening agents.

A glass powder of the present invention is a glass powder, which is formed of alkali borosilicate glass, wherein the glass powder includes 0.1 mol % to 1.0 mol %, provided that 1.0 mol % is excluded, of Li.sub.2O+Na.sub.2O+K.sub.2O in a glass composition, has a molar ratio Li.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.35 to 0.65, a molar ratio Na.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.25 to 0.55, and a molar ratio K.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.025 to 0.20, and has a specific dielectric constant at 25° C. and 16 GHz of from 3.5 to 4.0 and a dielectric dissipation factor at 25° C. and 16 GHz of 0.0020 or less.

A join is provided that includes a first joining partner, a second joining partner having a surface, an electrically insulating component connecting the first joining partner in the second joining partner so that the first joining partner is electrically insulated from the second joining partner and so that the first joining partner extends from the surface. The electrically insulating component has a structure between the first and second joining partners that elongates from the surface along the first joining partner. The electrically insulating component and/or the structure is an at least partially crystallized glass.

A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and stable characteristics against temperature variation and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, silica, and strontium titanate. The content of the crystallized glass is 50 mass % to 80 mass %, the content of the alumina filler is 15.6 mass % to 31.2 mass % in terms of Al.sub.2O.sub.3, the content of silica is 0.4 mass % to 4.8 mass % in terms of SiO.sub.2, and the content of the strontium titanate is 4 mass % to 14 mass % in terms of SrTiO.sub.3.

A join is provided that has an electrically insulating component and two joining partners secured to one another and electrically insulated from one another by the electrically insulating component. The electrically insulating component has a surface that extends between the two joining partners. The surface defines a structure selected from a group consisting of an elevation, a depression, and any combinations thereof. The structure elongates a direct path along the surface. The structure completely surrounds at least one of the two joining partners. The electrically insulating component and/or the structure includes a glass that is at least partially crystallized.

Described herein are materials and methods useful in the field of insulation, including building materials, refrigeration, cryogenics, and shipping, amongst others. Advantageously, the provided materials and method provide low thermal conductivities and increased mechanical strength, allowing for efficient insulating in a diverse range of applications. The provided materials and methods include individual particles connected by a polymer network that links individual particles and may include hollow or evacuated capsules and various strengthening agents.