The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

An insulating tape having a mica layer, a reinforcing layer having a filler and a fiber reinforcing material laminated on the mica layer, and a cellulose derivative layer laminated on the reinforcing layer is provided. One or more hydroxyl groups in the glucose units of the cellulose derivative are substituted with a functional group such as CH.sub.2CH.sub.2OH or (CH.sub.2CH.sub.2O).sub.pH (where p is any repeating number up to 50). The weight per unit area of the mica ranges from 100 g/m.sup.2 to 200 g/m.sup.2. The filler has a maximum particle size of 100 m or smaller and a weight per unit area ranging from 10 g/m.sup.2 to 50 g/m.sup.2. The insulating tape is useful to form a stator coil insulating layer with high thermal conductivity, with no outflow of a filler to the exterior during production of the stator coil, and with enhanced bonding strength.

An insulating tape having a mica layer, a reinforcing layer having a filler and a fiber reinforcing material laminated on the mica layer, and a cellulose derivative layer laminated on the reinforcing layer is provided. One or more hydroxyl groups in the glucose units of the cellulose derivative are substituted with a functional group such as CH.sub.2CH.sub.2OH or (CH.sub.2CH.sub.2O).sub.pH (where p is any repeating number up to 50). The weight per unit area of the mica ranges from 100 g/m.sup.2 to 200 g/m.sup.2. The filler has a maximum particle size of 100 m or smaller and a weight per unit area ranging from 10 g/m.sup.2 to 50 g/m.sup.2. The insulating tape is useful to form a stator coil insulating layer with high thermal conductivity, with no outflow of a filler to the exterior during production of the stator coil, and with enhanced bonding strength.