A PTC starter is provided. A first pin is electrically connected to a first electrode of a thermistor. The thermistor and an elastic element are arranged in respective mounting cavities. The elastic element is provided with a connecting piece, through which a second pin is electrically connected to or disconnected from a second electrode of the thermistor. In a normal state of the thermistor, the elastic element is in an elastic deformation state, a first contact part and a second contact part of the elastic element are in electrical contact with the second electrode of the thermistor and the second pin respectively. After the thermistor ruptures, the elastic element resets, which causes the connecting piece to move so that the second contact part of the elastic element detaches from the second pin. An isolation structure is provided between the thermistor mounting cavity and the elastic element mounting cavity.

A switch gear system is described. In some implementations, a switch gear arrestor system can include a switch gear and one or more arrestors mounted on a non-conductive insulated bar. The one or more arrestors can be connected to one or more isolators through a respective aperture in the non-conductive insulated bar. Each arrestor can be connected to one of the one or more electrical energy sources at a first end and can be connected to one of the one or more isolators at a second end. The switch gear arrestor system can further include one or more ground leads. Each ground lead can connect one of the one or more isolators to a conductive grounding bar.

A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.

A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.

A resistor assembly can be used in a tap changer. The resistor assembly may include: a resistor element, which is held by at least two resistor holders; a base plate with at least one opening and on which the at least two resistor holders holding the resistor element are arranged; a plurality of guides, respectively formed in each of the resistor holders and being configured to position a first end and a second end of the resistor element with respect to a longitudinal direction between the two resistor holders; and contact points of the resistor element, the contact points being electrically contacted by contacts of the tap changer in a condition where the resistor element is inserted into the resistor holder.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A support arrangement for an electrical protection assembly for connection between an electrical power supply line and electrical equipment is provided. The support arrangement comprises a first insulator body and a second insulator body extending at right angles to the first insulator body, wherein the first and second insulator bodies are integrally formed into a unitary body. In an embodiment, the second insulator body extends from a lower end of the first insulator body, so as to define a unitary L-shaped support arrangement. In one version, the support arrangement comprises an L-shaped inner support frame around which the first and second insulator bodies are molded. The L-shaped inner support frame comprises a T-shaped metal connector having a first end from which a first fibre glass support arm extends, around which the first insulator body is molded, and a second end from which a second fibre glass support arm extends, around which the second insulator body is molded.

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

A shunt resistor capable of reducing an absolute value of a temperature coefficient of resistance is disclosed. The shunt resistor includes: a base structure including a resistance element and a pair of electrodes; a bridge structure configured to bridge the pair of electrodes and made of a conductor; and connections configured to couple the pair of electrodes to the bridge structure. The bridge structure has a higher resistance than a resistance of the base structure at the connections.

A shunt resistor capable of reducing an absolute value of a temperature coefficient of resistance is disclosed. The shunt resistor includes: a base structure including a resistance element and a pair of electrodes; a bridge structure configured to bridge the pair of electrodes and made of a conductor; and connections configured to couple the pair of electrodes to the bridge structure. The bridge structure has a higher resistance than a resistance of the base structure at the connections.