A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.

A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A sulfurization detection resistor includes: a rectangle-shaped insulating substrate; pair of front electrodes formed at both ends facing each other on a surface of the insulating substrate; plurality of sulfurization detection conductors arranged in parallel between the paired front electrodes; plurality of resistors connected between the ends of each of the sulfurization detection conductors and the paired front electrodes; and sulfide gas impermeable protective film that covers all of the resistors and some of the sulfurization detection conductors, wherein each of the sulfurization detection conductors has a sulfurization detection unit exposed from a window hole in the protective film; and by covering the sulfurization detection units with different types of sulfurization rate adjustment layers formed of an acrylic resin, a silicon resin, and the like, timing of disconnection is set so as to vary in response to a cumulative amount of sulfurization in each of the sulfurization detection units.

A sulfurization detection resistor includes: a rectangle-shaped insulating substrate; pair of front electrodes formed at both ends facing each other on a surface of the insulating substrate; plurality of sulfurization detection conductors arranged in parallel between the paired front electrodes; plurality of resistors connected between the ends of each of the sulfurization detection conductors and the paired front electrodes; and sulfide gas impermeable protective film that covers all of the resistors and some of the sulfurization detection conductors, wherein each of the sulfurization detection conductors has a sulfurization detection unit exposed from a window hole in the protective film; and by covering the sulfurization detection units with different types of sulfurization rate adjustment layers formed of an acrylic resin, a silicon resin, and the like, timing of disconnection is set so as to vary in response to a cumulative amount of sulfurization in each of the sulfurization detection units.

An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.

An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.

A medical temperature monitoring system includes an electrical wire set having a thermistor at a distal end of the wire set configured to sense temperatures to which the thermistor is exposed; an electronic circuit in electrical communication with the wire set and the thermistor and configured to convert the temperatures sensed by the thermistor to temperature display signals; a display in electrical communication with the electronic circuit for receiving the temperature display signals and displaying temperatures corresponding to the temperature display signals; and a bead of cured protective material encapsulating the thermistor. The protective material is a radiation curable adhesive applied to the thermistor in an uncured state and then cured to encapsulate the thermistor. The bead of cured protective material electrically isolates the conductor sufficient to pass a Hi-Pot test at 500 VAC, <0.1 mA.

An all-printed physically unclonable function based on a single-walled carbon nanotube network. The network may be a mixture of semiconducting and metallic nanotubes randomly tangled with each other through the printing process. The unique distribution of carbon nanotubes in a network can be used for authentication, and this feature can be a secret key for a high level hardware security. The carbon nanotube network does not require any advanced purification process, alignment of nanotubes, high-resolution lithography and patterning. Rather, the intrinsic randomness of carbon nanotubes is leveraged to provide the unclonable aspect.