A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A composite electronic component includes: a body part including a dielectric portion; first and second external electrodes disposed on outer surfaces of the body part; a plurality of first and second electrodes disposed inside of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes disposed on an upper portion of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; a gap provided between the third and fourth electrodes; a groove disposed below the gap; and an electrostatic discharge (ESD) layer disposed in the gap.

A composite electronic component includes a body having first and second external electrodes disposed on outer surfaces thereof and including a dielectric body; first and second electrodes disposed in the dielectric body and electrically connected to the first and second external electrodes, respectively; a third electrode disposed on the body and electrically connected to the first external electrode; an electrostatic discharge (ESD) layer disposed on the third electrode; and a fourth electrode disposed on the ESD discharge layer and electrically connected to the second external electrode.

The present invention discloses an automatic tripping and anti-falling lightning arrester which includes an insulator main body, a lightning arrester body and an anti-falling member, wherein the insulator main body with a sealed cylinder structure, and a magnet adsorption surface inside the insulator main body; the lightning arrester body has a disconnection unit and a lightning arresting core respectively arranged from top to bottom, and the lightning arrester body is located inside the insulator main body, the disconnection unit includes a magnetic tripping module wherein a magnet is provided, and wherein the disconnection unit is adsorbed onto the magnet adsorption surface, wherein aging of the lightning arresting core results in a thermal effect inside the magnetic tripping module, which makes the disconnection unit disconnected from the magnet adsorption surface, and wherein the anti-falling member is provided on the insulator main body.

Provided is a resin molded body having excellent electromagnetic wave shielding properties in a high-frequency region of 1 GHz or more. The resin molded body containing a thermoplastic resin, plate-like graphite, at least one of carbon black and metal fibers, the content of the plate-like graphite being 50 parts by weight or more and 200 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin, the carbon black having a DBP oil absorption of 100 ml/100 g or more and 600 ml/100 g or less, the metal fibers having a diameter of 5 μm or more and 20 μm or less, the metal fibers having a fiber length of 2 mm or more and 12 mm or less, and the content of at least one of the carbon black and the metal fibers being 1 part by weight or more and 50 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin.

An arrangement has a coaxial resistor. The coaxial resistor is to be placed on an electrically conductive housing, and sensor lines of the coaxial resistor are to be guided through an interior of the coaxial resistor into the interior of the electrically conductive housing and to be connected to an electrical interface in the electrically conductive housing.

An arrangement has a coaxial resistor. The coaxial resistor is to be placed on an electrically conductive housing, and sensor lines of the coaxial resistor are to be guided through an interior of the coaxial resistor into the interior of the electrically conductive housing and to be connected to an electrical interface in the electrically conductive housing.

A glass sealed thermistor having a shock absorbing structure includes: a thermistor device whose resistance value changes according to temperature; a glass sealing layer that hermetically protects a head and a contact electrode of the glass sealed thermistor; a pair of conductive supporters having an electrical conductor function and a thermistor device support function; a shock absorbing structure formed by surrounding the pair of conductive supporters adjacent to the glass sealing layer; and a coating layer is coated on the glass sealing layer with polymer material.