An air cooled resistor arrangement comprising a first elongated tube member forming a first air flow channel and a second elongated tube member forming a second air flow channel, wherein the first elongated tube member is at least partly housed inside the second elongated tube member. The air-cooled resistor arrangement further comprises an air dilution portion comprising at least one opening at which the first air flow channel is arranged in fluid communication with the second air flow channel.

An air cooled resistor arrangement comprising a first elongated tube member forming a first air flow channel and a second elongated tube member forming a second air flow channel, wherein the first elongated tube member is at least partly housed inside the second elongated tube member. The air-cooled resistor arrangement further comprises an air dilution portion comprising at least one opening at which the first air flow channel is arranged in fluid communication with the second air flow channel.

An assembly may be provided that includes a controller configured to be coupled with at least one blower drive that operates a blower motor to cool resistive elements that dissipate electrical power as heat. The controller may be configured to determine whether the electrical power is no longer received by the resistive elements and operate the at least one blower drive to operate the blower motor to cool the resistive elements responsive to the electrical power no longer being received by the resistive elements

Cooling arrangements are disclosed for solid state circuit breakers. In one arrangement, a MOV is disposed between two pulsating heat pipes. An IGCT is disposed on the other side of each pulsating heat pipe away from the MOV. In another arrangement, a bus bar is integral with a heat spreader disposed between a pulsating heat pipe and an IGCT.

Cooling arrangements are disclosed for solid state circuit breakers. In one arrangement, a MOV is disposed between two pulsating heat pipes. An IGCT is disposed on the other side of each pulsating heat pipe away from the MOV. In another arrangement, a bus bar is integral with a heat spreader disposed between a pulsating heat pipe and an IGCT.

An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.

An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.

A power diffusing assembly includes a power diffusing body disposed along a flow path of a compressible fluid. The power diffusing body includes passages extending through the power diffusing body and through which at least part of the fluid flows through the power diffusing body. The power diffusing body receives an incoming flow profile of the fluid on an inlet side of the power diffusing body, directs the fluid through the passages in the power diffusing body, and outputs an outgoing flow profile of the fluid out of an outlet side of the power diffusing body. Arrangements of the passages in the power diffusing body are based on the incoming flow profile of the fluid that are received by the power diffusing body and are based on a desired profile of the outgoing flow profile of the fluid exiting out of the power diffusing body.

A power diffusing assembly includes a power diffusing body disposed along a flow path of a compressible fluid. The power diffusing body includes passages extending through the power diffusing body and through which at least part of the fluid flows through the power diffusing body. The power diffusing body receives an incoming flow profile of the fluid on an inlet side of the power diffusing body, directs the fluid through the passages in the power diffusing body, and outputs an outgoing flow profile of the fluid out of an outlet side of the power diffusing body. Arrangements of the passages in the power diffusing body are based on the incoming flow profile of the fluid that are received by the power diffusing body and are based on a desired profile of the outgoing flow profile of the fluid exiting out of the power diffusing body.

An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.