A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.

A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.

An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.

One aspect is a resistor component for surface mounting on a printed circuit board, including a ceramic substrate with a first side and an opposite second side. A sinterable metallization is at least in some regions arranged on the second side. A resistance element comprising a metal layer is arranged at least in some regions on the first side of the ceramic substrate with a first connection and a second connection. An insulation layer is arranged at least in some regions on the resistance element and the ceramic substrate. A first region on the first connection and a second region on the second connection remain uncovered by the insulation layer. A first contact pad electrically contacts the first connection via the first region, and a second contact pad electrically contacts the second connection via the second region. The first contact pad at least in some regions covers a first surface region of the insulation layer and the second contact pad at least in some regions covers a second surface region of the insulation layer, and the first and the second contact pads are arranged spatially separated from one another on the insulation layer.

An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.

A multilayer device and a method for producing a multilayer device are disclosed. In an embodiment a multilayer device includes a main body having at least two external electrodes, at least one first internal electrode; at least one second internal electrode, wherein each internal electrode is electrically conductively connected to an external electrode, a plurality of ceramic layers, wherein the ceramic layers comprise the internal electrodes and at least one dielectric layer, wherein, viewed along a stack direction of the ceramic layers, the dielectric layer being arranged between the internal electrodes, and wherein the dielectric layer is printed onto at least one sub-region of one of the ceramic layers.

A surface-mountable over-current protection device comprises at least one PTC material layer, a first conductive layer, a second conductive layer, a first electrode, a second electrode, an insulating layer, and a cover layer. The PTC material layer comprises crystalline polymer and conductive fillers dispersed therein. The first conductive layer and the second conductive layer are disposed on a first surface and a second surface of the PTC material layer, respectively. The first electrode and the second electrode are electrically connected to the first conductive layer and the second conductive layer, respectively. The insulating layer is disposed between the first electrode and the second electrode for insulation. The cover layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the surface-mountable over-current protection device.

A chip component comprises: an insulating substrate on which a resistor serving as a functional element is formed; a pair of internal electrodes (front electrodes, end surface electrodes, and back electrodes) that is formed to cover both end portions of the insulating substrate and connected to the resistor; a barrier layer that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer that is formed on a surface of the barrier layer and mainly composed of tin, and the barrier layer is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content ratio of phosphorus relative to nickel is set in a range of 0.5% to 5% so that the barrier layer has magnetism.

A transient voltage protection device includes: an element body; a cavity portion provided in the element body; a pair of internal electrodes disposed in the element body; and a pair of external electrodes connected to the pair of internal electrodes. The pair of internal electrodes extend along a first direction and face each other in a second direction intersecting the first direction. The cavity portion includes a gap region located between the pair of internal electrodes in the second direction. A tip portion of at least one of the pair of internal electrodes is in contact with only the element body.

The invention relates to a PTC heating element (1). The PTC heating element (1) comprises a block-shaped PTC thermistor (2) having two contact surfaces (4a, 4b) and two electrically conductive contact plates (3a, 3b). The PTC thermistor (2) is arranged between the contact plates (3a, 3b) and facing the contact plates (3a, 3b) with the contact surfaces (4a, 4b). An adhesion-promoting electrically conductive bonding layer (6a, 6b) each is arranged between the contact surface (4a, 4b) and the contact plate (3a, 3b). The PTC thermistor (2) is firmly connected to the respective contact plates (3a, 3b) by means of the respective bonding layers (6a, 6b) and electrically conductively contacted.

The adhesion-promoting electrically conductive bonding layer (6a, 6b) according to the invention comprises silicone or consists thereof.