An electrical isolation device including a support with thickness E including two faces facing one another, referred to, respectively, as the two faces having a length L, a width l; on each face of the support, a plurality of voltage dividers is positioned extending over the length, each voltage divider including electrical components that are connected in series and arranged according to a first and a second stage, each first stage including a row of even components and a row of odd components, the rows being parallel, and adjacent, and the second stage corresponding to a linear arrangement of components.

An electronic device (10) includes: a power supply (11); a first switch (12) that is connected at least to one pole of the power supply (11) and interrupts power supplied from the power supply (11) to a load (13); a second switch (14) that is positioned on a load (13) side with reference to the first switch (12) and interrupts power supplied from the power supply (11) to the load (13); a first power line (L11) that is connected to one end portion of an electric contact of the second switch (14), the one end portion being located on a first-switch (12) side; a second power line (L12) that is connected to another end portion of the electric contact of the second switch (14); a third power line (L13) that is connected to another pole of the power supply (11); and an electric element (resistor 15) that is connected between the first and second power lines (L11, L12) in parallel to the electric contact or connected between the first and third power lines (L11, L13), such that the electric contact of the second switch (14) is not charged when the first and second switches (12, 14) interrupt power.

An electronic device (10) includes: a power supply (11); a first switch (12) that is connected at least to one pole of the power supply (11) and interrupts power supplied from the power supply (11) to a load (13); a second switch (14) that is positioned on a load (13) side with reference to the first switch (12) and interrupts power supplied from the power supply (11) to the load (13); a first power line (L11) that is connected to one end portion of an electric contact of the second switch (14), the one end portion being located on a first-switch (12) side; a second power line (L12) that is connected to another end portion of the electric contact of the second switch (14); a third power line (L13) that is connected to another pole of the power supply (11); and an electric element (resistor 15) that is connected between the first and second power lines (L11, L12) in parallel to the electric contact or connected between the first and third power lines (L11, L13), such that the electric contact of the second switch (14) is not charged when the first and second switches (12, 14) interrupt power.

A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

An amplifier receives an input and a feedback. A first transistor controlled by the amplifier output is coupled between a supply node and the feedback. A second transistor controlled by the amplifier output is coupled to the supply node and generates a bias current. A trimmed resistor coupled between the feedback and ground includes, for trimming resolution of N-bits, where X+Y=N: M resistors, where M=2.sup.X−1, each having a resistance equal to R*(2.sup.Y)*i, i being an index having a value ranging from 1 to 2.sup.X−1, a first of the M resistors having a resistance of R*2.sup.Y, a last of the M resistors having a resistance of R*2.sup.Y*(2.sup.X−1); and M switches associated with the M resistors. Each of the M resistors is between a first node and its associated one of the M switches. Each of the M switches couples its associated one of the M resistors to a second node.

A four-terminal-pair AC quantum resistance dissemination bridge and related methods are provided. The bridge includes: a supply transformer IVD1, a Kelvin branch A1, a Wagner branch A0, the first and second current sources A2, A3, an injection inductive voltage divider A4, a ratio transformer IVD2, the first and second four-terminal AC resistor connection points Z1, Z2, chokes H, and null indicators D. An isolated inductive winding LO is wound along the ratio transformer IVD2 and supplies excitation current to primary winding of injection inductive voltage divider A4 to avoid the mutual influence among various balance networks and rapid balance of the bridge can be realized. By changing turn ratio of primary winding L3 and secondary winding L4 of the second inductive voltage divider T2, the phase shift can be realized through only one set of capacitors for imaginary part error compensation, the bridge with multiple frequency points can be obtained.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

An electronic device and method for efficiently processing overheat in an electronic device are provided. The electronic device includes a transceiver and at least one processor configured to identify overheat inside the electronic device and transmit, to a base station, a first message containing overheat assistance information generated in response to identifying the overheat inside the electronic device.

A method of forming a resistor circuit, the method comprising forming a first resistor comprising a first type of resistor, forming a second resistor comprising a second type of resistor, the first type of resistor being different from the second type of resistor and simultaneously doping a first part of the first resistor and a second part of the second resistor, the first resistor and the second resistor being configured such that doping of the first part of the first resistor and the second part of the second resistor defines a temperature coefficient of the first resistor and a temperature coefficient of the second resistor, wherein the temperature coefficient of the first resistor and the temperature coefficient of the second resistor have opposite signs.