A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; and an oxidation impeding layer formed on a non-oxidized surface corresponding to an upper surface of the resistor.

A chip resistor includes an insulating substrate, a resistance element, and an electrode. The resistance element includes Cr, Si, and N and is disposed on the insulating substrate. The electrode includes at least one refractory metal and is disposed on the resistance element. An atomic ratio of Si to Cr in the resistance element is greater than or equal to and less than or equal to 4 at least at a center of the resistance element in a thickness direction defined with respect to the resistance element. An atom percentage of N in the resistance element is lower than or equal to 50 atom % at least at the center of the resistance element in the thickness direction.

A motor vehicle operating liquid tank, in particular for storing aqueous urea solution, with a tank shell surrounding a tank volume and with a tank opening extending through the tank shell, a planar heating device in the tank volume is provided with an electrical resistance heating track arranged sandwiched between two plastic films that oppose one another in a planar manner and encase the resistance heating track, the plastic films opposing one another in a planar manner and each have a layer of compatible, thermoplastic plastics at least on their surfaces facing one another which are connected to one another locally at least along a seam track surrounding the electrical resistance heating track, slot areas are provided inside this seam track in which plastic film sections lie opposite one another in an unconnected manner without the intermediate arrangement of a section of a resistance heating track between them.

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; and an oxidation impeding layer formed on a non-oxidized surface corresponding to an upper surface of the resistor.

The present invention provides a ring varistor for use in DC micromotor including a ring varistor substrate having nonlinear volt-ampere characteristics and at least three independent electrodes evenly sintered on an end face of the ring varistor substrate. The electrode gap between two adjacent electrodes consists of two straight parallel edges of the two adjacent electrodes, and an inner and an outer concentric arc on the substrate ring, the electrode gap is not orthogonal to the ring. Due to the asymmetry arrangement of the surface electrodes and the electrode gaps, the electrode materials and the substrate materials with different thermal conductivity have no contact cross distribution with each other at the radial electrode gap. During welding, the heat shock is transmitted asymmetrically through the asymmetric electrodes, to improve the uniformity of the heat conduction distribution of the varistor and reduce the defective rate of the substrate welding fracture.

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.