A resistor arrangement for measuring current strength having connection elements and a resistor element between the connection elements. The connection elements and the resistor element are arranged in a plane and in a row such that the arrangement is strip-shaped and has its smallest spatial extent perpendicular to the current direction. The resistor element has two contact sides and the connection elements each have a contact face connected to the contact sides. When current flows through the arrangement, current flow lines are formed which are deflected at at least one of the contact sides by an angle of at least 5° at the transition from the connection element to the resistor element.

A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.

A sulfurization detection resistor makes it possible to detect a degree of sulfurization accurately and easily, and a manufacturing method for such sulfurization detection resistor. A sulfurization detection resistor includes an insulated substrate having a rectangular parallelepiped shape, a first front electrode and a second front electrode formed at both ends on a main surface of the insulated substrate, multiple sulfurization detecting conductors connected in parallel to the first front electrode, multiple resistive elements connected between the sulfurization detecting conductors and the second front electrode, and a protective film formed to partially cover the sulfurization detecting conductors and entirely cover the resistive elements. The sulfurization detecting conductors have their sulfurization detecting portions exposed out of the protective film, and different timings are set for these sulfurization detecting portions respectively to become disconnected depending on a cumulative amount of sulfurization.

A resistor component includes an insulating substrate; a resistance layer disposed on a first surface of the insulating layer; and first and second terminals, spaced apart from each other, disposed on an external surface of the insulating substrate and connected to the resistance layer; a marking pattern portion disposed on a second surface of the insulating layer, opposing the first surface of the insulating substrate; and a marking protection layer disposed on the second surface and covering the marking pattern portion.

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.

A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.

A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.