A temperature sensor includes: a first supporting film made of an electric insulation material; a second supporting film that is made of an electric insulation material and is stacked on the first supporting film; and a sensor element provided between the first supporting film and the second supporting film. The sensor element includes a thermosensitive body having electric characteristics that change with temperature, and a first lead pattern and a second lead pattern that are electrically connected to the thermosensitive body. The first supporting film and the second supporting film are disposed to face each other in a region where the thermosensitive body is provided.

A thermistor includes a thermistor element, a protective film formed on the surface of the thermistor element, and electrode portions formed on both end portions of the thermistor element, in which the protective film is formed of silicon oxide, and, as a result of observing a bonding interface between the thermistor element and the protective film, a ratio L/L.sub.0 of a length L of an observed peeled portion to a length L.sub.0 of the bonding interface in an observation field is 0.16 or less.

A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes an end surface facing in a first direction, and internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction. The external electrode is provided on the end surface and includes two protrusions that are formed along two peripheral portions of the end surface and protrude in the first direction, the two peripheral portions being disposed in a third direction orthogonal to the first direction and the second direction.

A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A temperature sensor provided with: an element that comprises a resistor which has a resistance value that changes with temperature thereof, and a lead wire; a signal wire that is bonded to the lead wire by welding; and a cover that covers the element and a welded part between the lead wire and the signal wire, where the lead wire comprises a material in which oxide particles are dispersed in platinum or platinum alloy; and the welded part has a welded part interface region along an interface with the lead wire or the signal wire, and a welded part main region inside thereof, and a volume ratio of the oxide particles occupying the welded part interface region is larger than a volume ratio of the oxide particles occupying the welded part main region.

A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.

A resistive material for sensing current contains particles having an electrically insulating property and a metal body having a three-dimensional network enclosing the particles, and a ratio of the metal body to the whole of the resistive material is 30 vol % or more and 80 vol % or less.

A temperature sensor in a rotating electric machine is disposed or installed on a surface of a temperature detection object. The temperature detection object, i.e., an installation portion, has a thickness. The temperature sensor has an inner case housing a detector element. The inner case is made of resin. The inner case has a thickness. A temperature detecting device has an outer case housing the temperature sensor. The outer case is made of resin. A linear expansion coefficient of the outer case is, within a certain temperature range including a threshold temperature for a protection of the rotating electric machine, is smaller than an average of linear expansion coefficients of the installation portion and the inner case.

The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.