A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.

A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.

A solid state circuit breaker that may include a metal oxide varistor (MOV) that is connected in series to a thyristor, the MOV to clamp voltage of current flowing through the solid state circuit breaker; the thyristor including a gate to control flow of the current to the MOV along a first path to the MOV; a breakover diode to activate at a target voltage level to allow the current to flow to the MOV along a second path; and a Zener diode to close the gate and allow current to flow along the first path in response to the current on the second path.

A solid state circuit breaker that may include a metal oxide varistor (MOV) that is connected in series to a thyristor, the MOV to clamp voltage of current flowing through the solid state circuit breaker; the thyristor including a gate to control flow of the current to the MOV along a first path to the MOV; a breakover diode to activate at a target voltage level to allow the current to flow to the MOV along a second path; and a Zener diode to close the gate and allow current to flow along the first path in response to the current on the second path.

There may be two active snubbers for direct current (dc) solid-state circuit breakers (SSCBs): metal-oxide-varistor with resistor-capacitor-switch (MOV-RCS) and active-MOV with resistor-capacitor-diode (AMOV-RCD). In the snubber branch, either half- or full-controlled switch can be used, leading to four topologies. The improved snubbers offer several improvements: 1) MOV is disconnected from the power line during SSCB OFF-state, which enhances reliability as neither voltage nor power appears on MOV; 2) voltage utilization rate ηv of the main switch is remarkably increased, which improves efficiency and power density, and reduces design cost shows experiments of five prototypes are conducted including four proposed snubbers and a comparison with conventional MOV-RCD snubber.

There may be two active snubbers for direct current (dc) solid-state circuit breakers (SSCBs): metal-oxide-varistor with resistor-capacitor-switch (MOV-RCS) and active-MOV with resistor-capacitor-diode (AMOV-RCD). In the snubber branch, either half- or full-controlled switch can be used, leading to four topologies. The improved snubbers offer several improvements: 1) MOV is disconnected from the power line during SSCB OFF-state, which enhances reliability as neither voltage nor power appears on MOV; 2) voltage utilization rate ηv of the main switch is remarkably increased, which improves efficiency and power density, and reduces design cost shows experiments of five prototypes are conducted including four proposed snubbers and a comparison with conventional MOV-RCD snubber.

A surge protection apparatus is disclosed. The surge protection apparatus includes a housing; electronics contained in the housing; and a plurality of metal tabs electrically connected to the electronics, the metal tabs being configured to connect to a terminal block of a relay panel in a substation, the metal tabs electrically connecting the terminal block to the electronics to provide EMP surge protection to the relay panel

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.

A chip varistor includes an element body exhibiting varistor characteristics, internal electrodes containing a first electrically conductive material, and an intermediate conductor containing a second electrically conductive material. The intermediate conductor is separated from the internal electrodes in a direction in which the internal electrodes oppose each other, and is disposed between the internal electrodes. At least a part of the intermediate conductor overlaps the internal electrodes in the direction in which the internal electrodes oppose each other. The element body includes a low resistance region in which the second electrically conductive material is diffused. The low resistance region is located between the first and second internal electrodes in the direction in which the first and second internal electrodes oppose each other.

A chip varistor includes an element body exhibiting varistor characteristics, internal electrodes containing a first electrically conductive material, and an intermediate conductor containing a second electrically conductive material. The intermediate conductor is separated from the internal electrodes in a direction in which the internal electrodes oppose each other, and is disposed between the internal electrodes. At least a part of the intermediate conductor overlaps the internal electrodes in the direction in which the internal electrodes oppose each other. The element body includes a low resistance region in which the second electrically conductive material is diffused. The low resistance region is located between the first and second internal electrodes in the direction in which the first and second internal electrodes oppose each other.