A choke is used to carry out high-voltage tests. The choke includes: a housing; a coil arranged in an interior of the housing; at least one electrically conductive component arranged between the coil and the housing; and a flux guide configured to guide a magnetic flux that is configured to be generated by the coil. The flux guide includes a ferromagnetic material; and is arranged between the coil and the at least one electrically conductive component in such a way that the magnetic flux that is configured to be generated by the coil is guided past the electrically conductive component.

A choke is used to carry out high-voltage tests. The choke includes: a housing; a coil arranged in an interior of the housing; at least one electrically conductive component arranged between the coil and the housing; and a flux guide configured to guide a magnetic flux that is configured to be generated by the coil. The flux guide includes a ferromagnetic material; and is arranged between the coil and the at least one electrically conductive component in such a way that the magnetic flux that is configured to be generated by the coil is guided past the electrically conductive component.

The present disclosure relates to semiconductor structures and, more particularly, to series inductors and methods of manufacture. A structure includes a plurality of wiring levels each of which include a wiring structure connected in series to one another. A second wiring level being located above a first wiring level of the plurality of wiring levels. A wiring structure on the second wiring level being at least partially outside boundaries of the wiring structure of the first wiring level.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

A common mode choke is provided, including a hollow ferrite core, a plurality of coils wound around the ferrite core, and a substrate. Each of the coils has a first end and a second end. The substrate is disposed on the side of the ferrite core and has a plurality of through holes. The first and second ends of the coils are engaged in the through holes. When viewed along the central axis of the ferrite core, the first and second ends of the coils are located on the outer side the ferrite core.

A common mode choke is provided, including a hollow ferrite core, a plurality of coils wound around the ferrite core, and a substrate. Each of the coils has a first end and a second end. The substrate is disposed on the side of the ferrite core and has a plurality of through holes. The first and second ends of the coils are engaged in the through holes. When viewed along the central axis of the ferrite core, the first and second ends of the coils are located on the outer side the ferrite core.

An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.

A multilayer electronic component includes a multilayer structure that includes dielectric layers stacked in a stack direction and has first and second surfaces provided on respective sides in the stack direction, a first side-surface electrode provided on a side surface of the multilayer structure, an inductor provided in the multilayer structure, a capacitor provided between the inductor and the first surface, a via wiring line penetrating dielectric layers from a first dielectric layer, which is in contact with the inductor, to a second dielectric layer, which is located closer to the first surface than at least a part of the capacitor, and electrically connecting a first end of the inductor and the first side-surface electrode, and a second side-surface electrode electrically connected to the first side-surface electrode through the inductor and the via wiring line and provided on the side surface or another side surface of the multilayer structure.