A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

An inductor device includes a first trace, a second trace, a first connection member, and a second connection member. The first trace includes a first sub-trace and a second sub-trace. The second sub-trace is disposed adjacent to the first sub-trace directly. The second trace includes a third sub-trace. The third sub-trace is disposed adjacent to the second sub-trace directly. The first connection member is configured to couple to the first sub-trace. The second connection member is disposed adjacent to the first connection member, and configured to couple to the second sub-trace.

An inductor component includes an element body, a coil on the body and spirally wound along an axis, first and second external electrodes electrically connected to the coil, and first and second through wirings which penetrate a substrate of the element body between main surfaces. The first coil wirings and through wirings, and the second coil wirings and through wirings, are connected as follows. With respect to two of the first through wirings adjacent to each other in a direction of the axis, on the first main surface, a relationship between a radius of an equivalent circle diameter of an end surface of each of the first through wirings and a minimum distance between end surfaces of the two first through wirings is satisfied, and with respect to two of the second through wirings adjacent to each other in the direction of the axis, a similar relationship is satisfied.

A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the first conductive line. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap. The semiconductor device structure includes a second conductive line over the conductive via structure and the first photosensitive dielectric layer. The semiconductor device structure includes a second protection cap over the second conductive line. The semiconductor device structure includes a second photosensitive dielectric layer over the first photosensitive dielectric layer, the second conductive line, and the second protection cap.

An inductor includes a coil that is provided in a component body. A first end of the coil is connected to a first outer electrode, and a second end of the coil is connected to a second outer electrode. The coil includes a plurality of coil conductor layers that are provided in a width direction. Each coil conductor layer is substantially spirally formed with the number of turns being greater than or equal to about one turn. The height of the component body is greater than the width of the component body.

An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.

An inductor device includes a first trace, a second trace, an input/output terminal, a center-tapped terminal, and an interlaced connection portion. The first trace is located on a first layer. The second is located on the first layer. The input/output terminal is disposed at a first side of the inductor device. The center-tapped terminal is disposed at a second side of the inductor device. The interlaced connection portion is disposed at a third side or a fourth side of the inductor device, and coupled to the first trace or the second trace. No interlaced connection structure is disposed along a connection line between the input/output terminal and the center-tapped terminal.

An electronic substrate may be fabricated having a dielectric material, metal pads embedded in the dielectric material with co-planar surfaces spaced less than one tenth millimeter from each other, and a metal trace embedded in the dielectric material and attached between the metal pads, wherein a surface of the metal trace is non-co-planar with the co-planar surfaces of the metal pads at a height of less than one millimeter, and wherein sides of the metal trace are angled relative to the co-planar surfaces of the metal pads. In an embodiment of the present description, an embedded angled inductor may be formed that includes the metal trace. In an embodiment, an integrated circuit package may be formed with the electronic substrate, wherein at least one integrated circuit devices may be attached to the electronic substrate. Other embodiments are disclosed and claimed.

An inductor component comprising a base body; a coil on the base body and wound helically along an axis; and first and second external electrodes disposed on the base body and connected electrically to the coil. The base body includes a substrate having first and second main surfaces that face each other; and an insulating layer on the first main surface. The coil includes first and second coil wires respectively disposed on the first and second main surfaces and covered with the insulating layer; and first and second through wires extending through the substrate from the first main surface to the second main surface and opposite to each other with respect to the axis. The first coil wire, the first through wire, the second coil wire, and the second through wire are connected in the mentioned order, to make up at least a part of the helical.