A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

A planar inductor may include a first coil and a second coil. The first coil may include a first trace that forms a first set of turns. The second coil may include a second trace that forms a second set of turns. A distance between the turns of the first set of turns may be equal to a distance between the turns of the second set of turns. A width of the first trace may be equal to a width of the second trace. The first coil and the second coil may be physically positioned or sized according to a/b in which a represents the width of the first trace and b represents the distance between the turns of the first set of turns.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover at least parts of first and second end surfaces. A stacking direction and a coil axis direction are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction is from 85% to 95% of a length of the multilayer body. A distance between coil conductors adjacent to each other in the stacking direction lies in a range from 12 μm to 40 μm.

Disclosed herein is a coil component that includes: a coil part having a structure in which alternately stacking a plurality of conductor layers each including a spiral coil pattern and a plurality of insulating layers; a first magnetic layer disposed in an inner diameter area of the coil part, in an outside area of the coil part, and on one side in an axial direction of the coil part; and a second magnetic layer disposed on other side in the axial direction of the coil part. Each of the first and second magnetic layers comprises a composite magnetic material containing magnetic fillers and binder resin. The content of the magnetic filers in the first magnetic layer is higher than the content of the magnetic fillers in the second magnetic layer.

An inductor device includes a first trace, a second trace, a first connection member, and a second connection member. The first trace includes a first sub-trace and a second sub-trace. The second sub-trace is disposed adjacent to the first sub-trace directly. The second trace includes a third sub-trace. The third sub-trace is disposed adjacent to the second sub-trace directly. The first connection member is configured to couple to the first sub-trace. The second connection member is disposed adjacent to the first connection member, and configured to couple to the second sub-trace.

A coil component includes a body; a support substrate embedded in the body; a coil portion disposed on the support substrate, and having an end portion exposed to a surface of the body; and an external electrode disposed on the surface of the body, and in contact with and connected to the end portion of the coil portion. An interface between the end portion of the coil portion and the external electrode, and an interface between the surface of the body and the external electrode are located on levels different from each other.

A semiconductor device includes a die having an input port and an output port. The semiconductor device also includes a multilayer package substrate with pads on a surface of the multilayer package substrate configured to be coupled to circuit components of a printed circuit board. The multilayer package substrate also includes a passive filter comprising an input port and an output port, and a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to the input port of the die with a second via of the multilayer package substrate. The planar inductor extends parallel to the surface of the multilayer package substrate.

A coil component according to one embodiment of the present invention includes: a base body having a plurality of magnetic layers; a first external electrode provided on the base body; a second external electrode provided on the base body and spaced from the first external electrode; a coil conductor provided in the base body; a first lead-out conductor including a first lead-out conductor first pattern and a first lead-out conductor second pattern; and a second lead-out conductor connecting a second end of the coil conductor and the second external electrode. The first lead-out conductor first pattern is provided between the magnetic layers so as to be connected to a first end of the coil conductor and the first external electrode. The first lead-out conductor second pattern is provided between the magnetic layers so as to be connected to the first lead-out conductor first pattern and the first external electrode.

Embodiments of the disclosure provide an integrated circuit (IC) structure. The IC structure may include a first metal layer on a substrate, and a second metal layer on the substrate that is horizontally separated from the first metal layer. A dielectric material may include a first portion on the first metal layer, and having a first upper surface, a second portion on the second metal layer, and having a second upper surface, and a third portion on the substrate between the first metal layer and the second metal layer. The third portion of the dielectric material includes a third upper surface above the first upper surface of the first portion and the second upper surface of the second portion of the dielectric material.

An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.