In large area plasma processing systems, process gases may be introduced to the chamber via the showerhead assembly which may be driven as an RF electrode. The gas feed tube, which is grounded, is electrically isolated from the showerhead. The gas feed tube may provide not only process gases, but also cleaning gases from a remote plasma source to the process chamber. The inside of the gas feed tube may remain at either a low RF field or a zero RF field to avoid premature gas breakdown within the gas feed tube that may lead to parasitic plasma formation between the gas source and the showerhead. By feeding the gas through an RF choke, the RF field and the processing gas may be introduced to the processing chamber through a common location and thus simplify the chamber design.

An EMI filter for an inverter may include a choke including a magnetic inner core, a magnetic outer core, and at least one conductor pair. The at least one conductor pair may include an electrically conductive positive conductor and an electrically conductive negative conductor. The inner core, the outer core, the positive conductor, and the negative conductor may extend along a longitudinal central axis of the choke. The inner core may be arranged in the outer core. The positive conductor and the negative conductor may be arranged between the inner core and the outer core. The positive conductor and the negative conductor may be arranged spaced apart from one another in a circumferential direction extending around the longitudinal central axis. A gap may be formed between the inner core, the outer core, the positive conductor, and the negative conductor, which are adjacent in the circumferential direction.

A substrate includes a multilayer substrate body in which a plurality of circuit bodies are laminated in a laminating direction through insulating layers and are interlayer connected via a connected conductor formed on each of the insulating layers, and a magnetic body that is arranged in the laminating direction while at least a part of or all of the magnetic body sandwiches the circuit bodies. Each of the circuit bodies includes at least a first circuit body and a second circuit body. The first circuit body is formed of a first extending portion and a first folding portion. The second circuit body is formed of a second extending portion and a second folding portion.

A power system has a power-electronic module that includes a housing defining a looped reservoir, a ferro-magnetic medium sealed within and filling the looped reservoir, and a conductor surrounded by the ferro-magnetic medium. The conductor is coiled within and along the looped reservoir, and has terminals extending out of the reservoir such that the ferro-magnetic medium and conductor form an inductor that opposes changes in magnitude of current flowing through the conductor.

An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.

Embodiments disclosed herein include electronic packages with embedded magnetic materials and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of dielectric layers. In an embodiment a plurality of passive components is located in a first dielectric layer of the plurality of dielectric layers. In an embodiment, first passive components of the plurality of passive components each comprise a first magnetic material, and second passive components of the plurality of passive components each comprise a second magnetic material. In an embodiment, a composition of the first magnetic material is different than a composition of the second magnetic material.

An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly and a method of fabricating the inductor structure. The inductor structure includes: an electrically conductive body; and a magnetic structure including a non-electrically-conductive magnetic material, wherein: one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith; and at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another.

The present invention relates to the technical field of coupled inductors, in particular discloses a fully coupled magnetic device, including at least two phases of circuits, with each phase formed by several coupling units connected in series. Every two phases of circuits are directly coupled through at least one coupling unit, and a direction of a magnetic field generated by DC (direct current) of one phase of the two phases of circuits is opposite to that of another phase of the two phases of circuits. The fully coupled magnetic device of the present invention provides direct coupling between any two phases of circuits, which facilitates lower phase current ripple. It has excellent scalability with the highly regular device layout. It is small in size, low in cost, and highly integrated. The device is able to be integrated into a single chip by stacking itself on top of other semiconductor chips. It is also able to be directly built on top of power management integrated circuits (IC) fabricated in advance on a silicon wafer, thereby forming a monolithically integrated power supply, a miniaturized solution with no need of external magnetic devices. The resulting integrated power supplies are able to be applied to replace the traditional discrete-component-based power solutions in a variety of applications.

One aspect of the present disclosure relates to a power electronics device for an electrically-driven charging device for an engine, said power electronics device comprising one or more power electronics components which are designed to operate an electrically-driven charging device for an engine, first and second conductors for guiding current for the one or more power electronics components, and a choke for filtering electromagnetic interference. The choke has a magnetic core which forms a closed ring about the first and second conductors and comprises a tongue which extends, arising from the closed ring, between the first and second conductors.

A wire harness including: a wire; a tubular first outer cover accommodating the wire; a positioning member that is made of a synthetic resin and is attached to an end of the first outer cover; and a ring-shaped electromagnetic wave absorber that has a through hole through which the wire passes and is fixed to the positioning member, wherein the positioning member has a main body including an insertion portion inserted into the through hole, and a fitting portion that protrudes from an end of the main body and is fitted on the end of the first outer cover.