H01F2017/067

MAGNETIC CORE OF AN ELECTRONIC ASSEMBLY
20230050004 · 2023-02-16 ·

The invention relates to a magnetic core (1) of an electronic arrangement, comprising a center region (3), a base (4a), which is formed in the shape of a planar plate, and a cover (4b), wherein the center region (3) is arranged between the base (4a) and the cover (4b), wherein a through-opening (2) with a center line (X) is formed in the center region (3), wherein a first cross-sectional area (9) of the magnetic core (1) in a first section plane (6), which is parallel to the base (4a) and in which the center line (X) is located, is substantially equal to a second cross-sectional area (8) of the magnetic core (1) in a second section plane (7), which is perpendicular to the first section plane (6) and in which the center line (X) is located, and wherein the base (4a) and the cover (4b) protrude beyond the center region (3) in the direction of the center line (X) on at least two mutually opposing sides.

POWER SYSTEM
20230230749 · 2023-07-20 ·

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

Inductor component and DC/DC converter using the same
11694833 · 2023-07-04 · ·

Disclosed herein is an inductor component that includes a magnetic core having magnetic thin ribbons laminated in a z-direction, a first coil conductor inserted into first and second through holes penetrating the magnetic core in the z-direction, and a second coil conductor inserted into third and fourth through holes penetrating the magnetic core in the z-direction. Each of the magnetic thin ribbons is divided into a plurality of small pieces by net-shaped cracks. A periphery of each of the first to fourth through holes is surrounded by the plurality of small pieces without being circumferentially divided by a slit having a size larger than the crack.

Power magnetic components packaged in otherwise unutilized space of power electronics

A power system has a power-electronic module that includes a housing defining a looped reservoir, a ferro-magnetic medium sealed within and filling the looped reservoir, and a conductor surrounded by the ferro-magnetic medium. The conductor is coiled within and along the looped reservoir, and has terminals extending out of the reservoir such that the ferro-magnetic medium and conductor form an inductor that opposes changes in magnitude of current flowing through the conductor.

MICROELECTRONIC ASSEMBLIES HAVING INTEGRATED MAGNETIC CORE INDUCTORS

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die in a first dielectric layer; a magnetic core inductor, having a first surface and an opposing second surface, in the first dielectric layer, including a first conductive pillar, having a first end at the first surface of the magnetic core inductor and an opposing second end at the second surface, at least partially surrounded by a magnetic material that extends at least partially along a thickness of the first conductive pillar from the second end and tapers towards the first end; and a second conductive pillar coupled to the first conductive pillar; and a second die in a second dielectric layer on the first dielectric layer coupled to the second surface of the magnetic core inductor.

MAGNETIC STRUCTURES AND ARRANGEMENT OF INDUCTIVE PATHS

According to one configuration, a fabricator receives magnetic permeable material and fabricates an apparatus to include a multi-dimensional arrangement of electrically conductive paths to extend through the magnetic permeable material. Each of the electrically conductive paths is a respective inductive path.

MAGNETIC STRUCTURES AND INDUCTIVE COUPLING CONTROL

According to one configuration, a fabricator fabricates a core of a circuit component to include magnetic permeable material. The fabricator further produces the circuit component to include multiple electrically conductive paths extending through the core of the magnetic permeable material. In one arrangement, the multiple electrically conductive paths include a first electrically conductive path and a second electrically conductive path. The fabricator fabricates the circuit component and, more specifically, the core of the magnetic permeable material to include at least one cutaway portion operative to reduce inductive coupling between the first electrically conductive path and the second electrically conductive path disposed in the core.

Electronic device
11605495 · 2023-03-14 · ·

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.

STACKED MAGNETIC INDUCTOR AND METHOD

An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within the through holes, such that an inductor structure has a length exceeding the core thickness.

Power module and method for delivering power to electronic device
11626237 · 2023-04-11 · ·

A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.