An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

According to an aspect of the present disclosure, a coil component includes: a body having a first surface and a second surface opposing each other in a first direction, and a plurality of side surfaces connecting the first surface and the second surface to each other; a substrate disposed in the body; at least one insulating pattern disposed on at least one corner where two of the plurality of side surfaces of the body are in contact with each other and exposed to the two side surfaces of the body; a coil unit including a coil pattern disposed on at least one surface of the substrate with a plurality of turns, and lead-out portions respectively exposed to opposing ones of the plurality of side surfaces of the body; and external electrodes disposed on the body and connected to the lead-out portions, respectively.

A superconducting wire according to one embodiment of the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; and respective coating layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective coating layers are disposed on the first surface and the fourth surface. Adhesion strength between the substrate and the coating layer disposed on the first surface is lower than adhesion strength between the superconducting layer and the coating layer disposed on the fourth surface.

A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.

A coil component includes a body having one surface and the other surface opposing each other, and one side surface and the other side surface, respectively connecting the one surface and the other surface to each other and opposing each other in one direction, a wound coil embedded in the body, a lead portion extending from an end of the wound coil to one surface of the body and disposed on the one surface of the body, an insulating layer covering one surface of the body and having an opening exposing a portion of the lead portion and extending in the one direction, and an external electrode disposed in the opening and connected to the lead portion. The insulating layer includes finishing portions respectively disposed on opposing sides of the opening in the one direction.

A spacer tape is provided for spacing apart turns of a winding, which comprises a tape having an upper surface, a lower surface and a longitudinal axis, wherein the lower surface is adhesable and configured to be adhered to a conductor forming a turn of the winding, and spacers with an upper surface and a lower surface arranged on the tape, wherein the lower surface of the spacers is adhered to the upper surface of the tape, and wherein the upper surface of the spacers are adhesable and configured to be adhered to the conductor forming an adjacent turn of the winding.

A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.

A reactor includes a coil including a wire that is covered with an insulating film and is wound, the coil including a first lateral surface and a second lateral surface different from the first lateral surface; a cooler that faces the first lateral surface; and an insulating heat radiation layer that is sandwiched between the first lateral surface and the cooler. In the first lateral surface, the wire is not covered with the insulating film. In the second lateral surface, the wire is covered with the insulating film. A degree of flatness of the first lateral surface is lower than a degree of flatness of the second lateral surface.

A thin film inductor is provided. The thin film inductor includes a first coil assembly, a first magnetic layer, and a second magnetic layer. The first coil assembly includes a first substrate and two first electrically conductive circuits respectively arranged on two surfaces of the first substrate that are opposite to each other. The first magnetic layer and the second magnetic layer are respectively arranged on the two surfaces of the first substrate that are opposite to each other, and the two first electrically conductive circuits are respectively embedded in the first magnetic layer and the second magnetic layer. The first substrate has a first non-circuit layout, and the first electrically conductive circuit is arranged around the first non-circuit layout. A ratio between an area of the first non-circuit layout and an area of the first substrate is 0.1 or more.

A multilayer coil component includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside, and outer electrodes on surfaces of the multilayer body and electrically connected to the coil. The insulating layers have a magnetic phase having spinel structure containing at least Fe, Ni, Zn, and Cu and a non-magnetic phase containing at least Si. When grain sizes D50 and D90 of crystal grains constituting the magnetic phase are respectively defined as equivalent-area circle diameters of 50% and 90% on a cumulative sum basis in a cumulative distribution of equivalent-area circle diameters of the crystal grains, the grain size D50 is from 50 nm to 750 nm, and the grain size D90 is from 200 nm to 1500 nm.